Benefits from condition monitoring techniques: a case study on maintenance scheduling of ball grid array solder joints

In the recent decade, more and more efforts in the field of reliability engineering are targeted towards developing condition-based maintenance (CBM) techniques for improving system availability and reducing maintenance cost. To justify the increased condition monitoring cost in a CBM programme, it...

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Veröffentlicht in:	Proceedings of the Institution of Mechanical Engineers. Part E, Journal of process mechanical engineering Journal of process mechanical engineering, 2011-08, Vol.225 (3), p.205-215
Hauptverfasser:	You, M-Y, Liu, F, Meng, G
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Arrays Bearings, bushings, rolling bearings BGA Comparative studies Condition monitoring Degradation Drives Exact sciences and technology Industrial metrology. Testing Integrated circuits Maintenance Maintenance costs Mechanical engineering. Machine design Monitoring systems Policies Reliability engineering Solders
Online-Zugang:	Volltext
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