Development of hot melt adhesive pad and its application to polishing of monocrystalline silicon

This study has developed a new polishing pad and an accompanying group of parameters for polishing monocrystalline silicon. A hot melt adhesive polishing pad coated with SiC abrasive uses these parameters more effectively and provides better polishing quality when compared with a conventional wool p...

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Veröffentlicht in:Proceedings of the Institution of Mechanical Engineers. Part B, Journal of engineering manufacture Journal of engineering manufacture, 2012-01, Vol.226 (1), p.92-102
Hauptverfasser: Tsai, S-L, Ke, H-Z, Ke, J-H, Huang, F-Y, Yan, B-H
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Sprache:eng
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