Reliability behavior of lead-free solder joints in electronic components

With more consumer products moving towards environmentally friendly packaging, making solder Pb-free has become an urgent task for electronics assemblies. Solder joints are responsible for both electrical and mechanical connections. Solder joint does not have adequate ductility to ensure the repeate...

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Veröffentlicht in:	Journal of materials science. Materials in electronics 2013, Vol.24 (1), p.172-190
Hauptverfasser:	Zhang, Liang, Han, Ji-guang, He, Cheng-wen, Guo, Yong-huan
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Brazing. Soldering Characterization and Evaluation of Materials Chemistry and Materials Science Constitutive equations Constitutive relationships Creep Design. Technologies. Operation analysis. Testing Electronic components Electronic devices Electronics Exact sciences and technology Fatigue life Integrated circuits Joining, thermal cutting: metallurgical aspects Lead free Materials Materials Science Mathematical analysis Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology Metals. Metallurgy Optical and Electronic Materials Review Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Solders
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