Solidification and reliability of lead-free solder interconnection

Purpose - As a literature review article, the purpose of this paper is to highlight the intricate interaction and correlation between the interconnection microstructure and the failure mechanism. It is therefore critical to summarize all the challenges in understanding solder solidification of inter...

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Veröffentlicht in:	Soldering & surface mount technology 2013-01, Vol.25 (1), p.31-38
Hauptverfasser:	Yu, Hao, Shangguan, Dongkai
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloys Crack propagation Deformation Dynamical systems Dynamics Electronics Failure Fatigue failure Grain boundaries Interconnection Intermetallic compounds Lead free Literature reviews Metal fatigue Microstructure Soldering Solders Solidification Stress concentration Studies Temperature
Online-Zugang:	Volltext
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