Reliability of assembly of chips and flex substrates using thermosonic flip-chip bonding process with a non-conductive paste

This study investigates the reliability of the assembly of chips and flex substrates using the thermosonic flip-chip bonding process with non-conductive paste (NCP). The high-temperature storage (HTS) test, the temperature cycling test (TCT), the pressure cooker test (PCT) and the high-temperature/h...

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Veröffentlicht in:	Microelectronic engineering 2010-11, Vol.87 (11), p.2146-2157
Hauptverfasser:	Chuang, Cheng-Li, Chen, Wei-How, Li, Hsun-Tien, Chen, Hui-Ta
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesive strength Applied sciences Bonding strength Chemical interdiffusion diffusion barriers Chips Condensed matter: electronic structure, electrical, magnetic, and optical properties Condensed matter: structure, mechanical and thermal properties Copper Cuprates superconductors (high tc and insulating parent compounds) Diffusion in solids Electrodes Exact sciences and technology Fatigue, brittleness, fracture, and cracks Flex substrates Gold Joining, thermal cutting: metallurgical aspects Mechanical and acoustical properties of condensed matter Mechanical properties of solids Metals. Metallurgy Non-conductive pastes Physics Reliability Superconductivity Thermosonic flip-chip bonding process Transport properties of condensed matter (nonelectronic) Ultrasonic testing Welding
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