Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages

Board-level thermomechanical fatigue lifetimes of five different wafer-level chip scale packages (WCSPs) with lead-free solder joints were studied by both experiment and finite element method modeling. The effect of three different constitutive laws of the lead-free solder, namely Anand viscoplastic...

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Veröffentlicht in:	Journal of electronic packaging 2010-03, Vol.132 (1), p.011005 (6)-011005 (6)
Hauptverfasser:	Zhao, Jie-Hua, Gupta, Vikas, Lohia, Alok, Edwards, Darvin
Format:	Artikel
Sprache:	eng
Schlagworte:	Chips Correlation Creep (materials) Fatigue (materials) Laws Mathematical models Packages Solders
Online-Zugang:	Volltext
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