Investigation on nitrogen-doped Ge2Sb2Te5 material for phase-change memory application

► The structure is studied by in situ Rs measurement and X-ray diffraction method. ► The grain size has been refined significantly by the doping of nitrogen atoms. ► A complete crystallization of the device is realized in the I–V sweeping process. Nitrogen-doped Ge2Sb2Te5 thin film is proposed to pr...

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Veröffentlicht in:Solid-state electronics 2013-01, Vol.79, p.138-141
Hauptverfasser: Yao, Dongning, Zhou, Xilin, Wu, Liangcai, Song, Zhitang, Cheng, Limin, Rao, Feng, Liu, Bo, Feng, Songlin
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container_end_page 141
container_issue
container_start_page 138
container_title Solid-state electronics
container_volume 79
creator Yao, Dongning
Zhou, Xilin
Wu, Liangcai
Song, Zhitang
Cheng, Limin
Rao, Feng
Liu, Bo
Feng, Songlin
description ► The structure is studied by in situ Rs measurement and X-ray diffraction method. ► The grain size has been refined significantly by the doping of nitrogen atoms. ► A complete crystallization of the device is realized in the I–V sweeping process. Nitrogen-doped Ge2Sb2Te5 thin film is proposed to present the feasibility for electrical phase-change memory application. The effect of nitrogen doping on the structure is studied by in situ sheet resistance measurement and X-ray diffraction method. The temperature upon crystallization from amorphous to cubic structure is increased by nitrogen addition, while the phase transformation to hexagonal phase occurs at a lower temperature compared with the nitrogen-free Ge2Sb2Te5 material. The X-ray diffraction test reveals that the grain size has been refined significantly by the incorporation of nitrogen atoms in the film. Phase-change memory device based on nitrogen incorporated Ge2Sb2Te5 material is fabricated using complementary metal oxide semiconductor technology. A complete crystallization of the phase-change cell is realized in the current–voltage sweeping process. Nitrogen-doped Ge2Sb2Te5 with higher sheet resistance in the crystalline state is favored for phase-change memory application due to the decreased reset voltage and promoted resistance ratio of the reset and set states.
doi_str_mv 10.1016/j.sse.2012.07.020
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Nitrogen-doped Ge2Sb2Te5 thin film is proposed to present the feasibility for electrical phase-change memory application. The effect of nitrogen doping on the structure is studied by in situ sheet resistance measurement and X-ray diffraction method. The temperature upon crystallization from amorphous to cubic structure is increased by nitrogen addition, while the phase transformation to hexagonal phase occurs at a lower temperature compared with the nitrogen-free Ge2Sb2Te5 material. The X-ray diffraction test reveals that the grain size has been refined significantly by the incorporation of nitrogen atoms in the film. Phase-change memory device based on nitrogen incorporated Ge2Sb2Te5 material is fabricated using complementary metal oxide semiconductor technology. A complete crystallization of the phase-change cell is realized in the current–voltage sweeping process. 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source Elsevier ScienceDirect Journals
subjects Amorphous materials
Applied sciences
Crystallization
Data storage
Design. Technologies. Operation analysis. Testing
Diffraction
Electrical resistivity
Electrical switching
Electronics
Exact sciences and technology
Ge2Sb2Te5
Integrated circuits
Integrated circuits by function (including memories and processors)
Nitrogen atoms
Nitrogen doping
Phase change material
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
X-rays
title Investigation on nitrogen-doped Ge2Sb2Te5 material for phase-change memory application
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