60-GHz Band Copper Ball Vertical Interconnection for MMW 3-D System-in-Package Front-End Modules

In order to realize millimeter-wave (MMW) 3-D system-in-package (SiP) front-end modules, we propose a 60-GHz band copper ball vertical interconnection structure, which interconnects between vertically stacked substrates. The structure enables ICs to be placed between the vertically stacked substrate...

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Veröffentlicht in:	IEICE Transactions on Electronics 2012/07/01, Vol.E95.C(7), pp.1276-1284
Hauptverfasser:	YOSHIDA, Satoshi, TANIFUJI, Shoichi, KAMEDA, Suguru, SUEMATSU, Noriharu, TAKAGI, Tadashi, TSUBOUCHI, Kazuo
Format:	Artikel
Sprache:	eng
Schlagworte:	60-GHz band Applied sciences COMPUTER SIMULATION CONNECTORS (ELECTRICAL) Copper copper balls CU Design. Technologies. Operation analysis. Testing Electromagnetic fields Electronic equipment and fabrication. Passive components, printed wiring boards, connectics ELECTRONIC PRODUCTS Electronics Exact sciences and technology Hardware Input-output equipment Integrated circuits Interconnection millimeter-wave Modules PACKAGING Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Simulation system-in-package Three dimensional Transmission loss vertical interconnection WPAN
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