Radio Frequency Thermal Plasma Treatment for Size Reduction and Spheroidization of Glass Powders Used in Ceramic Electronic Devices

Radio frequency (RF) thermal plasma treatment is studied for the size reduction and the spheroidization of coarse glass particles to change them into submicrometer‐sized powders of spherical shape. Such ultra‐fine spherical powders are the key ingredients of a sintering aid to achieve efficient pack...

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Veröffentlicht in:Journal of the American Ceramic Society 2007-06, Vol.90 (6), p.1717-1722
Hauptverfasser: Seo, Jun Ho, Kim, Dong Uk, Nam, Jun Seok, Hong, Sang Hee, Sohn, Sung Bum, Song, Soon Mo
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container_end_page 1722
container_issue 6
container_start_page 1717
container_title Journal of the American Ceramic Society
container_volume 90
creator Seo, Jun Ho
Kim, Dong Uk
Nam, Jun Seok
Hong, Sang Hee
Sohn, Sung Bum
Song, Soon Mo
description Radio frequency (RF) thermal plasma treatment is studied for the size reduction and the spheroidization of coarse glass particles to change them into submicrometer‐sized powders of spherical shape. Such ultra‐fine spherical powders are the key ingredients of a sintering aid to achieve efficient package and high performance in ceramic electronic applications. The coarse glass powders injected into the high‐temperature RF thermal plasma undergo rapid heating, melting, and evaporation, followed by quenching, and then condense to very fine spherical powders. In the thermal plasma treatment with high RF powers of 18–23 kW at a powder feeding rate of 3 g/min, the scanning electron microscopy images and the particle size distribution graphs obtained from the treated glass powders indicate that most glass powders with initial average diameters of around 2 μm are reformed into spherical ones with sizes of below 500 nm. It is also observed in a 4 MHz RF thermal plasma reactor that the maximum size of particles decreases down to 200 nm when the reactor is operated under conditions of reduced pressure, low powder feeding rate, and high RF power. The compositions of glass powders before and after the plasma treatment are compared by using the wet and the inductively coupled plasma‐optical emission spectroscopy analyses. Negligible composition changes appear within a range of
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Such ultra‐fine spherical powders are the key ingredients of a sintering aid to achieve efficient package and high performance in ceramic electronic applications. The coarse glass powders injected into the high‐temperature RF thermal plasma undergo rapid heating, melting, and evaporation, followed by quenching, and then condense to very fine spherical powders. In the thermal plasma treatment with high RF powers of 18–23 kW at a powder feeding rate of 3 g/min, the scanning electron microscopy images and the particle size distribution graphs obtained from the treated glass powders indicate that most glass powders with initial average diameters of around 2 μm are reformed into spherical ones with sizes of below 500 nm. It is also observed in a 4 MHz RF thermal plasma reactor that the maximum size of particles decreases down to 200 nm when the reactor is operated under conditions of reduced pressure, low powder feeding rate, and high RF power. The compositions of glass powders before and after the plasma treatment are compared by using the wet and the inductively coupled plasma‐optical emission spectroscopy analyses. Negligible composition changes appear within a range of &lt;2 wt% during the RF thermal plasma process, which demonstrates the successful preparation of submicrometer‐sized glass powders in spherical shape applicable to the advanced ceramic electronic devices.</description><identifier>ISSN: 0002-7820</identifier><identifier>EISSN: 1551-2916</identifier><identifier>DOI: 10.1111/j.1551-2916.2007.01645.x</identifier><identifier>CODEN: JACTAW</identifier><language>eng</language><publisher>Malden, USA: Blackwell Publishing Inc</publisher><subject>Applied sciences ; Building materials. Ceramics. 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The compositions of glass powders before and after the plasma treatment are compared by using the wet and the inductively coupled plasma‐optical emission spectroscopy analyses. Negligible composition changes appear within a range of &lt;2 wt% during the RF thermal plasma process, which demonstrates the successful preparation of submicrometer‐sized glass powders in spherical shape applicable to the advanced ceramic electronic devices.</description><subject>Applied sciences</subject><subject>Building materials. Ceramics. 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subjects Applied sciences
Building materials. Ceramics. Glasses
Ceramic industries
Ceramic powders
Ceramics
Chemical industry and chemicals
Electrotechnical and electronic ceramics
Exact sciences and technology
Glass
Glasses
Manufacture
Radio frequencies
Reactors
Spheroidizing
Technical ceramics
Thermal plasmas
title Radio Frequency Thermal Plasma Treatment for Size Reduction and Spheroidization of Glass Powders Used in Ceramic Electronic Devices
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