Radio Frequency Thermal Plasma Treatment for Size Reduction and Spheroidization of Glass Powders Used in Ceramic Electronic Devices
Radio frequency (RF) thermal plasma treatment is studied for the size reduction and the spheroidization of coarse glass particles to change them into submicrometer‐sized powders of spherical shape. Such ultra‐fine spherical powders are the key ingredients of a sintering aid to achieve efficient pack...
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Veröffentlicht in: | Journal of the American Ceramic Society 2007-06, Vol.90 (6), p.1717-1722 |
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description | Radio frequency (RF) thermal plasma treatment is studied for the size reduction and the spheroidization of coarse glass particles to change them into submicrometer‐sized powders of spherical shape. Such ultra‐fine spherical powders are the key ingredients of a sintering aid to achieve efficient package and high performance in ceramic electronic applications. The coarse glass powders injected into the high‐temperature RF thermal plasma undergo rapid heating, melting, and evaporation, followed by quenching, and then condense to very fine spherical powders. In the thermal plasma treatment with high RF powers of 18–23 kW at a powder feeding rate of 3 g/min, the scanning electron microscopy images and the particle size distribution graphs obtained from the treated glass powders indicate that most glass powders with initial average diameters of around 2 μm are reformed into spherical ones with sizes of below 500 nm. It is also observed in a 4 MHz RF thermal plasma reactor that the maximum size of particles decreases down to 200 nm when the reactor is operated under conditions of reduced pressure, low powder feeding rate, and high RF power. The compositions of glass powders before and after the plasma treatment are compared by using the wet and the inductively coupled plasma‐optical emission spectroscopy analyses. Negligible composition changes appear within a range of |
doi_str_mv | 10.1111/j.1551-2916.2007.01645.x |
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Such ultra‐fine spherical powders are the key ingredients of a sintering aid to achieve efficient package and high performance in ceramic electronic applications. The coarse glass powders injected into the high‐temperature RF thermal plasma undergo rapid heating, melting, and evaporation, followed by quenching, and then condense to very fine spherical powders. In the thermal plasma treatment with high RF powers of 18–23 kW at a powder feeding rate of 3 g/min, the scanning electron microscopy images and the particle size distribution graphs obtained from the treated glass powders indicate that most glass powders with initial average diameters of around 2 μm are reformed into spherical ones with sizes of below 500 nm. It is also observed in a 4 MHz RF thermal plasma reactor that the maximum size of particles decreases down to 200 nm when the reactor is operated under conditions of reduced pressure, low powder feeding rate, and high RF power. The compositions of glass powders before and after the plasma treatment are compared by using the wet and the inductively coupled plasma‐optical emission spectroscopy analyses. Negligible composition changes appear within a range of <2 wt% during the RF thermal plasma process, which demonstrates the successful preparation of submicrometer‐sized glass powders in spherical shape applicable to the advanced ceramic electronic devices.</description><identifier>ISSN: 0002-7820</identifier><identifier>EISSN: 1551-2916</identifier><identifier>DOI: 10.1111/j.1551-2916.2007.01645.x</identifier><identifier>CODEN: JACTAW</identifier><language>eng</language><publisher>Malden, USA: Blackwell Publishing Inc</publisher><subject>Applied sciences ; Building materials. Ceramics. Glasses ; Ceramic industries ; Ceramic powders ; Ceramics ; Chemical industry and chemicals ; Electrotechnical and electronic ceramics ; Exact sciences and technology ; Glass ; Glasses ; Manufacture ; Radio frequencies ; Reactors ; Spheroidizing ; Technical ceramics ; Thermal plasmas</subject><ispartof>Journal of the American Ceramic Society, 2007-06, Vol.90 (6), p.1717-1722</ispartof><rights>2007 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c4825-12d1ac2f142e6626ceb026784d18fc3b82e4dd235451674237922340e34ae1c93</citedby><cites>FETCH-LOGICAL-c4825-12d1ac2f142e6626ceb026784d18fc3b82e4dd235451674237922340e34ae1c93</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://onlinelibrary.wiley.com/doi/pdf/10.1111%2Fj.1551-2916.2007.01645.x$$EPDF$$P50$$Gwiley$$H</linktopdf><linktohtml>$$Uhttps://onlinelibrary.wiley.com/doi/full/10.1111%2Fj.1551-2916.2007.01645.x$$EHTML$$P50$$Gwiley$$H</linktohtml><link.rule.ids>315,781,785,1418,27928,27929,45578,45579</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=18870366$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Seo, Jun Ho</creatorcontrib><creatorcontrib>Kim, Dong Uk</creatorcontrib><creatorcontrib>Nam, Jun Seok</creatorcontrib><creatorcontrib>Hong, Sang Hee</creatorcontrib><creatorcontrib>Sohn, Sung Bum</creatorcontrib><creatorcontrib>Song, Soon Mo</creatorcontrib><title>Radio Frequency Thermal Plasma Treatment for Size Reduction and Spheroidization of Glass Powders Used in Ceramic Electronic Devices</title><title>Journal of the American Ceramic Society</title><description>Radio frequency (RF) thermal plasma treatment is studied for the size reduction and the spheroidization of coarse glass particles to change them into submicrometer‐sized powders of spherical shape. Such ultra‐fine spherical powders are the key ingredients of a sintering aid to achieve efficient package and high performance in ceramic electronic applications. The coarse glass powders injected into the high‐temperature RF thermal plasma undergo rapid heating, melting, and evaporation, followed by quenching, and then condense to very fine spherical powders. In the thermal plasma treatment with high RF powers of 18–23 kW at a powder feeding rate of 3 g/min, the scanning electron microscopy images and the particle size distribution graphs obtained from the treated glass powders indicate that most glass powders with initial average diameters of around 2 μm are reformed into spherical ones with sizes of below 500 nm. It is also observed in a 4 MHz RF thermal plasma reactor that the maximum size of particles decreases down to 200 nm when the reactor is operated under conditions of reduced pressure, low powder feeding rate, and high RF power. The compositions of glass powders before and after the plasma treatment are compared by using the wet and the inductively coupled plasma‐optical emission spectroscopy analyses. Negligible composition changes appear within a range of <2 wt% during the RF thermal plasma process, which demonstrates the successful preparation of submicrometer‐sized glass powders in spherical shape applicable to the advanced ceramic electronic devices.</description><subject>Applied sciences</subject><subject>Building materials. Ceramics. Glasses</subject><subject>Ceramic industries</subject><subject>Ceramic powders</subject><subject>Ceramics</subject><subject>Chemical industry and chemicals</subject><subject>Electrotechnical and electronic ceramics</subject><subject>Exact sciences and technology</subject><subject>Glass</subject><subject>Glasses</subject><subject>Manufacture</subject><subject>Radio frequencies</subject><subject>Reactors</subject><subject>Spheroidizing</subject><subject>Technical ceramics</subject><subject>Thermal plasmas</subject><issn>0002-7820</issn><issn>1551-2916</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2007</creationdate><recordtype>article</recordtype><recordid>eNqNkEtvEzEUhS0EEqHwH7xBYjODX-PxrFAV0vCIoDSpys5y7TvCYWYc7AlNuuWP4yRV2XI3vtf3O8fyQQhTUtJcb9clrSpasIbKkhFSl4RKUZW7J2jyuHiKJoQQVtSKkefoRUrrPNJGiQn6c2WcD_giwq8tDHaPVz8g9qbDl51JvcGrCGbsYRhxGyJe-nvAV-C2dvRhwGZweLnJguCdvzfHu9DieZYmfBnuHMSErxM47Ac8hWh6b_GsAzvGMOT2Pfz2FtJL9Kw1XYJXD-cZur6YraYfisXX-cfp-aKwQrGqoMxRY1lLBQMpmbRwS5islXBUtZbfKgbCOcYrUVFZC8brhjEuCHBhgNqGn6E3J99NDPm3adS9Txa6zgwQtklTohhteFPRjKoTamNIKUKrN9H3Ju4zpA-567U-xKsP8epD7vqYu95l6euHV0yypmujGaxP__RK1YRLmbl3J-7Od7D_b3_96Xw6O_bZoTg5-DTC7tHBxJ9a1ryu9M2XuV7eLPhn3nzX3_hfzAulyQ</recordid><startdate>200706</startdate><enddate>200706</enddate><creator>Seo, Jun Ho</creator><creator>Kim, Dong Uk</creator><creator>Nam, Jun Seok</creator><creator>Hong, Sang Hee</creator><creator>Sohn, Sung Bum</creator><creator>Song, Soon Mo</creator><general>Blackwell Publishing Inc</general><general>Blackwell</general><scope>BSCLL</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7QQ</scope><scope>7SR</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>200706</creationdate><title>Radio Frequency Thermal Plasma Treatment for Size Reduction and Spheroidization of Glass Powders Used in Ceramic Electronic Devices</title><author>Seo, Jun Ho ; Kim, Dong Uk ; Nam, Jun Seok ; Hong, Sang Hee ; Sohn, Sung Bum ; Song, Soon Mo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c4825-12d1ac2f142e6626ceb026784d18fc3b82e4dd235451674237922340e34ae1c93</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2007</creationdate><topic>Applied sciences</topic><topic>Building materials. Ceramics. Glasses</topic><topic>Ceramic industries</topic><topic>Ceramic powders</topic><topic>Ceramics</topic><topic>Chemical industry and chemicals</topic><topic>Electrotechnical and electronic ceramics</topic><topic>Exact sciences and technology</topic><topic>Glass</topic><topic>Glasses</topic><topic>Manufacture</topic><topic>Radio frequencies</topic><topic>Reactors</topic><topic>Spheroidizing</topic><topic>Technical ceramics</topic><topic>Thermal plasmas</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Seo, Jun Ho</creatorcontrib><creatorcontrib>Kim, Dong Uk</creatorcontrib><creatorcontrib>Nam, Jun Seok</creatorcontrib><creatorcontrib>Hong, Sang Hee</creatorcontrib><creatorcontrib>Sohn, Sung Bum</creatorcontrib><creatorcontrib>Song, Soon Mo</creatorcontrib><collection>Istex</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Ceramic Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of the American Ceramic Society</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Seo, Jun Ho</au><au>Kim, Dong Uk</au><au>Nam, Jun Seok</au><au>Hong, Sang Hee</au><au>Sohn, Sung Bum</au><au>Song, Soon Mo</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Radio Frequency Thermal Plasma Treatment for Size Reduction and Spheroidization of Glass Powders Used in Ceramic Electronic Devices</atitle><jtitle>Journal of the American Ceramic Society</jtitle><date>2007-06</date><risdate>2007</risdate><volume>90</volume><issue>6</issue><spage>1717</spage><epage>1722</epage><pages>1717-1722</pages><issn>0002-7820</issn><eissn>1551-2916</eissn><coden>JACTAW</coden><abstract>Radio frequency (RF) thermal plasma treatment is studied for the size reduction and the spheroidization of coarse glass particles to change them into submicrometer‐sized powders of spherical shape. Such ultra‐fine spherical powders are the key ingredients of a sintering aid to achieve efficient package and high performance in ceramic electronic applications. The coarse glass powders injected into the high‐temperature RF thermal plasma undergo rapid heating, melting, and evaporation, followed by quenching, and then condense to very fine spherical powders. In the thermal plasma treatment with high RF powers of 18–23 kW at a powder feeding rate of 3 g/min, the scanning electron microscopy images and the particle size distribution graphs obtained from the treated glass powders indicate that most glass powders with initial average diameters of around 2 μm are reformed into spherical ones with sizes of below 500 nm. It is also observed in a 4 MHz RF thermal plasma reactor that the maximum size of particles decreases down to 200 nm when the reactor is operated under conditions of reduced pressure, low powder feeding rate, and high RF power. The compositions of glass powders before and after the plasma treatment are compared by using the wet and the inductively coupled plasma‐optical emission spectroscopy analyses. Negligible composition changes appear within a range of <2 wt% during the RF thermal plasma process, which demonstrates the successful preparation of submicrometer‐sized glass powders in spherical shape applicable to the advanced ceramic electronic devices.</abstract><cop>Malden, USA</cop><pub>Blackwell Publishing Inc</pub><doi>10.1111/j.1551-2916.2007.01645.x</doi><tpages>6</tpages></addata></record> |
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subjects | Applied sciences Building materials. Ceramics. Glasses Ceramic industries Ceramic powders Ceramics Chemical industry and chemicals Electrotechnical and electronic ceramics Exact sciences and technology Glass Glasses Manufacture Radio frequencies Reactors Spheroidizing Technical ceramics Thermal plasmas |
title | Radio Frequency Thermal Plasma Treatment for Size Reduction and Spheroidization of Glass Powders Used in Ceramic Electronic Devices |
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