Processing and Thermal Conductivity of Sintered Reaction-Bonded Silicon Nitride. I: Effect of Si Powder Characteristics

This paper will present sintered reaction‐bonded silicon nitride (SRBSN) material with a high thermal conductivity of 121 W·(m·K)−1, which has been successfully prepared from a coarse Si powder with lower levels of oxygen and aluminum impurities, using a mixture of Y2O3 and MgSiN2 as sintering addit...

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Veröffentlicht in:	Journal of the American Ceramic Society 2006-11, Vol.89 (11), p.3331-3339
Hauptverfasser:	Zhu, Xinwen, Zhou, You, Hirao, Kiyoshi, Lenčéš, Zoltán
Format:	Artikel
Sprache:	eng
Schlagworte:	Abrasives and cutting tools Aluminum Applied sciences Building materials. Ceramics. Glasses Ceramic industries Ceramic sintering Chemical industry and chemicals Exact sciences and technology Heat conductivity Heat transfer Impurities Materials science Microstructure Nitriding Silicon Silicon nitride Structural ceramics Technical ceramics Thermal conductivity
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