Investigation of Post-Etch Copper Residue on Direct Bonded Copper (DBC) Substrates

For many years, direct bonded copper (DBC) substrates have proved to be an excellent solution for electrical isolation and thermal management of high-power semiconductor modules. However, in this study we detected a copper residue on the surface of DBC alumina, presumably a result of pattern etching...

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Veröffentlicht in:	Journal of electronic materials 2011-10, Vol.40 (10), p.2119-2125
Hauptverfasser:	Mei, Yunhui, Lu, Guo-Quan, Chen, Xu, Gang, Chen, Luo, Shufang, Ibitayo, Dimeji
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesive bonding ANODES Applied sciences BONDING BONDS CATHODES Characterization and Evaluation of Materials Chemistry and Materials Science Condensed matter: structure, mechanical and thermal properties Copper Dendritic structure DENDRITIC STRUCTURES Diffusion in solids Electric fields Electrical engineering ELECTRONIC PRODUCTS Electronics Electronics and Microelectronics ETCHING Exact sciences and technology Instrumentation Joining, thermal cutting: metallurgical aspects Materials Materials Science Metals. Metallurgy Optical and Electronic Materials Physics Residues SEMICONDUCTORS Solid State Physics Substrates Thermal management Transport properties of condensed matter (nonelectronic)
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