Effect of Pd Surface Roughness on the Bonding Process and High Temperature Reliability of Au Ball Bonds

A 0.3- μ m-thick electrolytic Pd layer was plated on 1  μ m of electroless Ni on 1 mm-thick polished and roughened Cu substrates with roughness values ( R a ) of 0.08  μ m and 0.5  μ m, respectively. The rough substrates were produced with sand-blasting. Au wire bonding on the Ni/Pd surface was opti...

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