Towards a Thermal Moore's Law

Thermal design power trends and power densities for present and future single-core microprocessors are investigated. These trends are derived based on Moore's law and scaling theory. Both active and stand-by power are discussed and accounted for in the calculations. A brief discussion of variou...

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Veröffentlicht in:	IEEE transactions on advanced packaging 2007-08, Vol.30 (3), p.462-474
Hauptverfasser:	Krishnan, S., Garimella, S.V., Chrysler, G.M., Mahajan, R.V.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Density Density factor Design. Technologies. Operation analysis. Testing Electric resistance Electronics Electrons Exact sciences and technology Heat sinks Integrated circuits Integrated circuits by function (including memories and processors) Logic Mathematical analysis Microprocessors Moore's Law power density Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Semiconductors Solid state circuits Studies Thermal conductivity Thermal design thermal design power Thermal energy Thermal resistance Thermoelectricity thermoelectrics Trends
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