Effect of joint sizes of low-temperature sintered nano-silver on thermal residual curvature of sandwiched assembly

Residual bending could be formed in sandwiched assembly as a result of coefficients of thermal expansion (CTEs) mismatch and temperature difference. An optical measurement system was developed to study the residual curvature of sandwiched assembly bonded by three different kinds of die-attachment ma...

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Veröffentlicht in:	International journal of adhesion and adhesives 2012-06, Vol.35, p.88-93
Hauptverfasser:	Mei, Yunhui, Chen, Gang, Guo-Quan, Lu, Chen, Xu
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Assembly Bending Curvature Die-attachment Exact sciences and technology Finite element method Joint size Low-temperature sintering Mathematical analysis Nano-silver Nanomaterials Nanostructure Physicochemistry of polymers Polymer industry, paints, wood Residual curvature Solders Technology of polymers
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