Chip-package codesign of a low-power 5-GHz RF front end
Future high-performance wireless communication applications such as wireless local area networks (WLANs) around 5 GHz require low-power and highly integrated transceiver solutions. The integration of the RF front end especially poses a great challenge in these applications, as traditional front-end...
Gespeichert in:
| Veröffentlicht in: | Proceedings of the IEEE 2000, Vol.88 (10), p.1583-1597 |
|---|---|
| Hauptverfasser: | , , , , , , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 1597 |
|---|---|
| container_issue | 10 |
| container_start_page | 1583 |
| container_title | Proceedings of the IEEE |
| container_volume | 88 |
| creator | Donnay, S. Pieters, P. Vaesen, K. Diels, W. Wambacq, P. De Raedt, W. Beyne, E. Engels, M. Bolsens, I. |
| description | Future high-performance wireless communication applications such as wireless local area networks (WLANs) around 5 GHz require low-power and highly integrated transceiver solutions. The integration of the RF front end especially poses a great challenge in these applications, as traditional front-end implementations require a large number of external passive components. In this paper, we present the single-package integration of complete transceivers based on a thin-film multichip module (MCM) technology with integrated passives. The MCM substrate is a a common carrier onto which different ICs are mounted. passive components such as RF bandpass filters, inductors, capacitors, and resistors are directly integrated into the MCM substrate with the use of the multilayer structure of the MCM technology. The "system-on-a-package" approach is illustrated with a voltage-controlled oscillator for Digital European Cordless Telephone (DECT) applications and a 5-GHz WLAN front end. These examples indicate that this approach yields a compact low-power implementation of complete transceivers for high-performance wireless applications. |
| doi_str_mv | 10.1109/5.888997 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_proquest_miscellaneous_1022890969</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>888997</ieee_id><sourcerecordid>2434114561</sourcerecordid><originalsourceid>FETCH-LOGICAL-c402t-22979e6bb27d0aad0d908c456b589f951d34820eb016cfc0894bdafaf8b64b73</originalsourceid><addsrcrecordid>eNqN0cFLwzAUBvAgCs4pePZUvOil-pIm6ctRhtuEgSC7lzRNZmfX1GRj6F9vZUPBg3p6h_fje_A-Qs4p3FAK6lbcIKJS-QEZUCEwZUzIQzIAoJgqRtUxOYlxCQCZkNmA5KPnuks7bV70wibGVzbWizbxLtFJ47dp57c2JCKdTN-Tp3Higm_XiW2rU3LkdBPt2X4OyXx8Px9N09nj5GF0N0sNB7bur6tcWVmWLK9A6woqBWi4kKVA5ZSgVcaRgS2BSuMMoOJlpZ12WEpe5tmQXO1iu-BfNzaui1UdjW0a3Vq_iYWiXDIlGPby-ldJ8xwy3lv5L8qQYwZ_U2AMFSipenr5gy79JrT9cwpEAVQgy77zTPAxBuuKLtQrHd76pOKzv0IUu_56erGjtbX2i-2XH5c8kJE</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>885015823</pqid></control><display><type>article</type><title>Chip-package codesign of a low-power 5-GHz RF front end</title><source>IEEE Electronic Library (IEL)</source><creator>Donnay, S. ; Pieters, P. ; Vaesen, K. ; Diels, W. ; Wambacq, P. ; De Raedt, W. ; Beyne, E. ; Engels, M. ; Bolsens, I.</creator><creatorcontrib>Donnay, S. ; Pieters, P. ; Vaesen, K. ; Diels, W. ; Wambacq, P. ; De Raedt, W. ; Beyne, E. ; Engels, M. ; Bolsens, I.</creatorcontrib><description>Future high-performance wireless communication applications such as wireless local area networks (WLANs) around 5 GHz require low-power and highly integrated transceiver solutions. The integration of the RF front end especially poses a great challenge in these applications, as traditional front-end implementations require a large number of external passive components. In this paper, we present the single-package integration of complete transceivers based on a thin-film multichip module (MCM) technology with integrated passives. The MCM substrate is a a common carrier onto which different ICs are mounted. passive components such as RF bandpass filters, inductors, capacitors, and resistors are directly integrated into the MCM substrate with the use of the multilayer structure of the MCM technology. The "system-on-a-package" approach is illustrated with a voltage-controlled oscillator for Digital European Cordless Telephone (DECT) applications and a 5-GHz WLAN front end. These examples indicate that this approach yields a compact low-power implementation of complete transceivers for high-performance wireless applications.</description><identifier>ISSN: 0018-9219</identifier><identifier>EISSN: 1558-2256</identifier><identifier>DOI: 10.1109/5.888997</identifier><identifier>CODEN: IEEPAD</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Band pass filters ; Capacitors ; Local area networks ; Multichip modules ; Multilayers ; Passive components ; Radio frequencies ; Radio frequency ; Resistors ; Substrates ; Thin film inductors ; Transceivers ; Transistors ; Wireless communication ; Wireless communications ; Wireless LAN</subject><ispartof>Proceedings of the IEEE, 2000, Vol.88 (10), p.1583-1597</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2000</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c402t-22979e6bb27d0aad0d908c456b589f951d34820eb016cfc0894bdafaf8b64b73</citedby><cites>FETCH-LOGICAL-c402t-22979e6bb27d0aad0d908c456b589f951d34820eb016cfc0894bdafaf8b64b73</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/888997$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,4009,27902,27903,27904,54736</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/888997$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Donnay, S.</creatorcontrib><creatorcontrib>Pieters, P.</creatorcontrib><creatorcontrib>Vaesen, K.</creatorcontrib><creatorcontrib>Diels, W.</creatorcontrib><creatorcontrib>Wambacq, P.</creatorcontrib><creatorcontrib>De Raedt, W.</creatorcontrib><creatorcontrib>Beyne, E.</creatorcontrib><creatorcontrib>Engels, M.</creatorcontrib><creatorcontrib>Bolsens, I.</creatorcontrib><title>Chip-package codesign of a low-power 5-GHz RF front end</title><title>Proceedings of the IEEE</title><addtitle>JPROC</addtitle><description>Future high-performance wireless communication applications such as wireless local area networks (WLANs) around 5 GHz require low-power and highly integrated transceiver solutions. The integration of the RF front end especially poses a great challenge in these applications, as traditional front-end implementations require a large number of external passive components. In this paper, we present the single-package integration of complete transceivers based on a thin-film multichip module (MCM) technology with integrated passives. The MCM substrate is a a common carrier onto which different ICs are mounted. passive components such as RF bandpass filters, inductors, capacitors, and resistors are directly integrated into the MCM substrate with the use of the multilayer structure of the MCM technology. The "system-on-a-package" approach is illustrated with a voltage-controlled oscillator for Digital European Cordless Telephone (DECT) applications and a 5-GHz WLAN front end. These examples indicate that this approach yields a compact low-power implementation of complete transceivers for high-performance wireless applications.</description><subject>Band pass filters</subject><subject>Capacitors</subject><subject>Local area networks</subject><subject>Multichip modules</subject><subject>Multilayers</subject><subject>Passive components</subject><subject>Radio frequencies</subject><subject>Radio frequency</subject><subject>Resistors</subject><subject>Substrates</subject><subject>Thin film inductors</subject><subject>Transceivers</subject><subject>Transistors</subject><subject>Wireless communication</subject><subject>Wireless communications</subject><subject>Wireless LAN</subject><issn>0018-9219</issn><issn>1558-2256</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2000</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNqN0cFLwzAUBvAgCs4pePZUvOil-pIm6ctRhtuEgSC7lzRNZmfX1GRj6F9vZUPBg3p6h_fje_A-Qs4p3FAK6lbcIKJS-QEZUCEwZUzIQzIAoJgqRtUxOYlxCQCZkNmA5KPnuks7bV70wibGVzbWizbxLtFJ47dp57c2JCKdTN-Tp3Higm_XiW2rU3LkdBPt2X4OyXx8Px9N09nj5GF0N0sNB7bur6tcWVmWLK9A6woqBWi4kKVA5ZSgVcaRgS2BSuMMoOJlpZ12WEpe5tmQXO1iu-BfNzaui1UdjW0a3Vq_iYWiXDIlGPby-ldJ8xwy3lv5L8qQYwZ_U2AMFSipenr5gy79JrT9cwpEAVQgy77zTPAxBuuKLtQrHd76pOKzv0IUu_56erGjtbX2i-2XH5c8kJE</recordid><startdate>2000</startdate><enddate>2000</enddate><creator>Donnay, S.</creator><creator>Pieters, P.</creator><creator>Vaesen, K.</creator><creator>Diels, W.</creator><creator>Wambacq, P.</creator><creator>De Raedt, W.</creator><creator>Beyne, E.</creator><creator>Engels, M.</creator><creator>Bolsens, I.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>F28</scope><scope>FR3</scope></search><sort><creationdate>2000</creationdate><title>Chip-package codesign of a low-power 5-GHz RF front end</title><author>Donnay, S. ; Pieters, P. ; Vaesen, K. ; Diels, W. ; Wambacq, P. ; De Raedt, W. ; Beyne, E. ; Engels, M. ; Bolsens, I.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c402t-22979e6bb27d0aad0d908c456b589f951d34820eb016cfc0894bdafaf8b64b73</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2000</creationdate><topic>Band pass filters</topic><topic>Capacitors</topic><topic>Local area networks</topic><topic>Multichip modules</topic><topic>Multilayers</topic><topic>Passive components</topic><topic>Radio frequencies</topic><topic>Radio frequency</topic><topic>Resistors</topic><topic>Substrates</topic><topic>Thin film inductors</topic><topic>Transceivers</topic><topic>Transistors</topic><topic>Wireless communication</topic><topic>Wireless communications</topic><topic>Wireless LAN</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Donnay, S.</creatorcontrib><creatorcontrib>Pieters, P.</creatorcontrib><creatorcontrib>Vaesen, K.</creatorcontrib><creatorcontrib>Diels, W.</creatorcontrib><creatorcontrib>Wambacq, P.</creatorcontrib><creatorcontrib>De Raedt, W.</creatorcontrib><creatorcontrib>Beyne, E.</creatorcontrib><creatorcontrib>Engels, M.</creatorcontrib><creatorcontrib>Bolsens, I.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><jtitle>Proceedings of the IEEE</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Donnay, S.</au><au>Pieters, P.</au><au>Vaesen, K.</au><au>Diels, W.</au><au>Wambacq, P.</au><au>De Raedt, W.</au><au>Beyne, E.</au><au>Engels, M.</au><au>Bolsens, I.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Chip-package codesign of a low-power 5-GHz RF front end</atitle><jtitle>Proceedings of the IEEE</jtitle><stitle>JPROC</stitle><date>2000</date><risdate>2000</risdate><volume>88</volume><issue>10</issue><spage>1583</spage><epage>1597</epage><pages>1583-1597</pages><issn>0018-9219</issn><eissn>1558-2256</eissn><coden>IEEPAD</coden><abstract>Future high-performance wireless communication applications such as wireless local area networks (WLANs) around 5 GHz require low-power and highly integrated transceiver solutions. The integration of the RF front end especially poses a great challenge in these applications, as traditional front-end implementations require a large number of external passive components. In this paper, we present the single-package integration of complete transceivers based on a thin-film multichip module (MCM) technology with integrated passives. The MCM substrate is a a common carrier onto which different ICs are mounted. passive components such as RF bandpass filters, inductors, capacitors, and resistors are directly integrated into the MCM substrate with the use of the multilayer structure of the MCM technology. The "system-on-a-package" approach is illustrated with a voltage-controlled oscillator for Digital European Cordless Telephone (DECT) applications and a 5-GHz WLAN front end. These examples indicate that this approach yields a compact low-power implementation of complete transceivers for high-performance wireless applications.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/5.888997</doi><tpages>15</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 0018-9219 |
| ispartof | Proceedings of the IEEE, 2000, Vol.88 (10), p.1583-1597 |
| issn | 0018-9219 1558-2256 |
| language | eng |
| recordid | cdi_proquest_miscellaneous_1022890969 |
| source | IEEE Electronic Library (IEL) |
| subjects | Band pass filters Capacitors Local area networks Multichip modules Multilayers Passive components Radio frequencies Radio frequency Resistors Substrates Thin film inductors Transceivers Transistors Wireless communication Wireless communications Wireless LAN |
| title | Chip-package codesign of a low-power 5-GHz RF front end |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T19%3A53%3A11IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Chip-package%20codesign%20of%20a%20low-power%205-GHz%20RF%20front%20end&rft.jtitle=Proceedings%20of%20the%20IEEE&rft.au=Donnay,%20S.&rft.date=2000&rft.volume=88&rft.issue=10&rft.spage=1583&rft.epage=1597&rft.pages=1583-1597&rft.issn=0018-9219&rft.eissn=1558-2256&rft.coden=IEEPAD&rft_id=info:doi/10.1109/5.888997&rft_dat=%3Cproquest_RIE%3E2434114561%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=885015823&rft_id=info:pmid/&rft_ieee_id=888997&rfr_iscdi=true |