Synthesis of hollow ellipsoidal silica nanostructures using a wet-chemical etching approach

[Display omitted] ► It is a facile process that directly produces ellipsoidal silica nanoshells. ► It results in ellipsoidal silica nanostructures with dimension less than 100nm. ► It results in silica structures with controllable shell thickness. We have utilized wet-chemical etching of ellipsoidal...

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Veröffentlicht in:Journal of colloid and interface science 2012-06, Vol.375 (1), p.106-111
Hauptverfasser: Zhang, Henan, Zhou, Yi, Li, Yueru, Bandosz, Teresa J., Akins, Daniel L.
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Sprache:eng
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Zusammenfassung:[Display omitted] ► It is a facile process that directly produces ellipsoidal silica nanoshells. ► It results in ellipsoidal silica nanostructures with dimension less than 100nm. ► It results in silica structures with controllable shell thickness. We have utilized wet-chemical etching of ellipsoidal silica nanoparticles (ESNs) to form silica nanoshells of a range of elliptical morphologies, with the thicknesses of the ellipsoidal silica nanoshells (ESSs) controlled through variation of synthesis conditions. A mechanism has been proposed to explain how the nanoshells are formed, and we demonstrate that the porosity of the silica ellipsoid plays a role in generating silica shells. Our self-templated, wet-etching approach is an attractive alternate procedure to the approaches presently in existence for the following reasons: (i) it is a facile, one-step process that directly produces ellipsoidal silica nanoshells, while overcoming barriers (such as requirement of removing a solid-core template seed) utilized in many reported chemical etching studies; (ii) it results in ellipsoidal silica nanostructures with dimension less than 100nm; (iii) with an appropriate etchant, the roughness of the silica shells can be well-controlled; and (iv) it results in tunable, uniform size particles with controllable shell thicknesses. Moreover, the silica materials with the unique structures might be adjusted to meet practical application requirements.
ISSN:0021-9797
1095-7103
DOI:10.1016/j.jcis.2012.02.046