Nonisothermal degradation kinetics for epoxy resin systems containing polymethylphenylsilsesquioxane
The thermal degradation behaviors of polymethylphenylsilsesquioxane/epoxy resin (PMPSQ/EP) systems were investigated by thermogravimetric analysis (TGA) under nonisothermal conditions in nitrogen atmosphere. During nonisothermal degradation, Kissinger's and Flynn‐Wall‐Ozawa's methods were...
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Veröffentlicht in: | Journal of applied polymer science 2012-01, Vol.123 (2), p.1024-1031 |
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creator | Wang, Jiangbo Zhan, Yeyong Fang, Jianghua Gao, Haoqi |
description | The thermal degradation behaviors of polymethylphenylsilsesquioxane/epoxy resin (PMPSQ/EP) systems were investigated by thermogravimetric analysis (TGA) under nonisothermal conditions in nitrogen atmosphere. During nonisothermal degradation, Kissinger's and Flynn‐Wall‐Ozawa's methods were both used to analyze the thermal degradation process. The results showed that a remarkable increase of activation energy was observed in the presence of PMPSQ, which indicated that the addition of PMPSQ retarded the thermal degradation of EP. Flynn‐Wall‐Ozawa's method further revealed that PMPSQ significantly increased the activation energy of EP thermal degradation especially in the early and final stage of thermal degradation process, which illustrated that the PMPSQ stabilized the char layer and improved the flame retardancy of EP. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011 |
doi_str_mv | 10.1002/app.34550 |
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During nonisothermal degradation, Kissinger's and Flynn‐Wall‐Ozawa's methods were both used to analyze the thermal degradation process. The results showed that a remarkable increase of activation energy was observed in the presence of PMPSQ, which indicated that the addition of PMPSQ retarded the thermal degradation of EP. Flynn‐Wall‐Ozawa's method further revealed that PMPSQ significantly increased the activation energy of EP thermal degradation especially in the early and final stage of thermal degradation process, which illustrated that the PMPSQ stabilized the char layer and improved the flame retardancy of EP. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011</description><identifier>ISSN: 0021-8995</identifier><identifier>ISSN: 1097-4628</identifier><identifier>EISSN: 1097-4628</identifier><identifier>DOI: 10.1002/app.34550</identifier><identifier>CODEN: JAPNAB</identifier><language>eng</language><publisher>Hoboken: Wiley Subscription Services, Inc., A Wiley Company</publisher><subject>Activation energy ; Applied sciences ; Atmospheres ; Chemical reactions and properties ; Combustion ; Degradation ; epoxy resin ; Epoxy resins ; Exact sciences and technology ; kinetics ; Materials science ; Organic polymers ; Physicochemistry of polymers ; Polymers ; polymethylphenylsilsesquioxane ; Thermal degradation ; Thermogravimetric analysis</subject><ispartof>Journal of applied polymer science, 2012-01, Vol.123 (2), p.1024-1031</ispartof><rights>Copyright © 2011 Wiley Periodicals, Inc.</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c3980-1b8fc58e9ac134e191abd0eaff1fc5c483e6a5443eb7a765db8b10f58d237f1b3</citedby><cites>FETCH-LOGICAL-c3980-1b8fc58e9ac134e191abd0eaff1fc5c483e6a5443eb7a765db8b10f58d237f1b3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://onlinelibrary.wiley.com/doi/pdf/10.1002%2Fapp.34550$$EPDF$$P50$$Gwiley$$H</linktopdf><linktohtml>$$Uhttps://onlinelibrary.wiley.com/doi/full/10.1002%2Fapp.34550$$EHTML$$P50$$Gwiley$$H</linktohtml><link.rule.ids>314,780,784,1417,27924,27925,45574,45575</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=25505810$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Wang, Jiangbo</creatorcontrib><creatorcontrib>Zhan, Yeyong</creatorcontrib><creatorcontrib>Fang, Jianghua</creatorcontrib><creatorcontrib>Gao, Haoqi</creatorcontrib><title>Nonisothermal degradation kinetics for epoxy resin systems containing polymethylphenylsilsesquioxane</title><title>Journal of applied polymer science</title><addtitle>J. Appl. Polym. Sci</addtitle><description>The thermal degradation behaviors of polymethylphenylsilsesquioxane/epoxy resin (PMPSQ/EP) systems were investigated by thermogravimetric analysis (TGA) under nonisothermal conditions in nitrogen atmosphere. During nonisothermal degradation, Kissinger's and Flynn‐Wall‐Ozawa's methods were both used to analyze the thermal degradation process. The results showed that a remarkable increase of activation energy was observed in the presence of PMPSQ, which indicated that the addition of PMPSQ retarded the thermal degradation of EP. Flynn‐Wall‐Ozawa's method further revealed that PMPSQ significantly increased the activation energy of EP thermal degradation especially in the early and final stage of thermal degradation process, which illustrated that the PMPSQ stabilized the char layer and improved the flame retardancy of EP. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011</description><subject>Activation energy</subject><subject>Applied sciences</subject><subject>Atmospheres</subject><subject>Chemical reactions and properties</subject><subject>Combustion</subject><subject>Degradation</subject><subject>epoxy resin</subject><subject>Epoxy resins</subject><subject>Exact sciences and technology</subject><subject>kinetics</subject><subject>Materials science</subject><subject>Organic polymers</subject><subject>Physicochemistry of polymers</subject><subject>Polymers</subject><subject>polymethylphenylsilsesquioxane</subject><subject>Thermal degradation</subject><subject>Thermogravimetric analysis</subject><issn>0021-8995</issn><issn>1097-4628</issn><issn>1097-4628</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2012</creationdate><recordtype>article</recordtype><recordid>eNp1kMFu1DAQhi0EEkvhwBtEQkhwSOuJ48Q5VitoQdXSSiC4WY4z7rp17NTOis3b12VLD0icRpr5_k-jn5C3QI-B0upETdMxqzmnz8gKaNeWdVOJ52SVb1CKruMvyauUbigF4LRZkWETvE1h3mIclSsGvI5qULMNvri1HmerU2FCLHAK-6WImKwv0pJmHFOhg5-V9dZfF1Nwy4jzdnHTFv3iknUJ093Ohr3y-Jq8MCov3jzOI_Lj86fv6_Py4tvZl_XpRalZJ2gJvTCaC-yUBlYjdKD6gaIyBvJe14Jho3hdM-xb1TZ86EUP1HAxVKw10LMj8uHgnWK422Ga5WiTRufyD2GXJNCqEoIDg4y--we9Cbvo83cSODQdZ3XTZOrjgdIxpBTRyCnaUcUlq-RD3zL3Lf_0ndn3j0aVtHImKq9tegpUmeECHriTA_fbOlz-L5Snl5d_zeUhYXPv-6eEireyaVnL5c_Nmfy6-QVXV-taMnYPdFKgzA</recordid><startdate>20120115</startdate><enddate>20120115</enddate><creator>Wang, Jiangbo</creator><creator>Zhan, Yeyong</creator><creator>Fang, Jianghua</creator><creator>Gao, Haoqi</creator><general>Wiley Subscription Services, Inc., A Wiley Company</general><general>Wiley</general><general>Wiley Subscription Services, Inc</general><scope>BSCLL</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20120115</creationdate><title>Nonisothermal degradation kinetics for epoxy resin systems containing polymethylphenylsilsesquioxane</title><author>Wang, Jiangbo ; Zhan, Yeyong ; Fang, Jianghua ; Gao, Haoqi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c3980-1b8fc58e9ac134e191abd0eaff1fc5c483e6a5443eb7a765db8b10f58d237f1b3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2012</creationdate><topic>Activation energy</topic><topic>Applied sciences</topic><topic>Atmospheres</topic><topic>Chemical reactions and properties</topic><topic>Combustion</topic><topic>Degradation</topic><topic>epoxy resin</topic><topic>Epoxy resins</topic><topic>Exact sciences and technology</topic><topic>kinetics</topic><topic>Materials science</topic><topic>Organic polymers</topic><topic>Physicochemistry of polymers</topic><topic>Polymers</topic><topic>polymethylphenylsilsesquioxane</topic><topic>Thermal degradation</topic><topic>Thermogravimetric analysis</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Wang, Jiangbo</creatorcontrib><creatorcontrib>Zhan, Yeyong</creatorcontrib><creatorcontrib>Fang, Jianghua</creatorcontrib><creatorcontrib>Gao, Haoqi</creatorcontrib><collection>Istex</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of applied polymer science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Wang, Jiangbo</au><au>Zhan, Yeyong</au><au>Fang, Jianghua</au><au>Gao, Haoqi</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Nonisothermal degradation kinetics for epoxy resin systems containing polymethylphenylsilsesquioxane</atitle><jtitle>Journal of applied polymer science</jtitle><addtitle>J. Appl. Polym. Sci</addtitle><date>2012-01-15</date><risdate>2012</risdate><volume>123</volume><issue>2</issue><spage>1024</spage><epage>1031</epage><pages>1024-1031</pages><issn>0021-8995</issn><issn>1097-4628</issn><eissn>1097-4628</eissn><coden>JAPNAB</coden><abstract>The thermal degradation behaviors of polymethylphenylsilsesquioxane/epoxy resin (PMPSQ/EP) systems were investigated by thermogravimetric analysis (TGA) under nonisothermal conditions in nitrogen atmosphere. During nonisothermal degradation, Kissinger's and Flynn‐Wall‐Ozawa's methods were both used to analyze the thermal degradation process. The results showed that a remarkable increase of activation energy was observed in the presence of PMPSQ, which indicated that the addition of PMPSQ retarded the thermal degradation of EP. Flynn‐Wall‐Ozawa's method further revealed that PMPSQ significantly increased the activation energy of EP thermal degradation especially in the early and final stage of thermal degradation process, which illustrated that the PMPSQ stabilized the char layer and improved the flame retardancy of EP. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011</abstract><cop>Hoboken</cop><pub>Wiley Subscription Services, Inc., A Wiley Company</pub><doi>10.1002/app.34550</doi><tpages>8</tpages></addata></record> |
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subjects | Activation energy Applied sciences Atmospheres Chemical reactions and properties Combustion Degradation epoxy resin Epoxy resins Exact sciences and technology kinetics Materials science Organic polymers Physicochemistry of polymers Polymers polymethylphenylsilsesquioxane Thermal degradation Thermogravimetric analysis |
title | Nonisothermal degradation kinetics for epoxy resin systems containing polymethylphenylsilsesquioxane |
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