Influence of Electroless Ni-P Film Condition on Wire Bondability

With increasing thickness of electroless gold films (greater than 0.5 μm) as a top layer, Au/Ni film shows good wire bondability. However, we confirmed that the deposited nickel structure influences wire bondability for thinner (less than 0.5 μm) electroless gold plating after heat treatment because...

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Veröffentlicht in:	Hyōmen gijutsu 2011/01/01, Vol.62(1), pp.47-47
Hauptverfasser:	KATO, Ikuhiro, TERASHIMA, Hajime, WATANABE, Hideto, HONMA, Hideo
Format:	Artikel
Sprache:	jpn
Schlagworte:	Au/Ni Process Bonding Columnar structure Deposition Electroless plating Gold Heat treatment Local Corrosion Nickel Wire Wire Bondability
Online-Zugang:	Volltext
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