Wetting of Cu and Al by Sn-Zn and Zn-Al Eutectic Alloys
Wetting properties of Sn-Zn and Zn-Al alloys on Cu and Al substrates were studied. Spreading tests were carried out for 3 min, in air and under protective atmosphere of nitrogen, with the use of fluxes. In the case of Zn-Al eutectic, spreading tests were carried out at 460, 480, 500, and 520 °C, and...
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| Veröffentlicht in: | Journal of materials engineering and performance 2012-05, Vol.21 (5), p.606-613 |
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| creator | Pstruś, Janusz Fima, Przemysław Gancarz, Tomasz |
| description | Wetting properties of Sn-Zn and Zn-Al alloys on Cu and Al substrates were studied. Spreading tests were carried out for 3 min, in air and under protective atmosphere of nitrogen, with the use of fluxes. In the case of Zn-Al eutectic, spreading tests were carried out at 460, 480, 500, and 520 °C, and in the case of Sn-Zn eutectic at 250, 300, 350, 400, 450, and 500 °C, respectively. Solidified solder/substrate couples were cross-sectioned and subjected to microstructure examination. The spreading tests indicated that the wetting properties of eutectic Sn-Zn alloys, on copper pads do not depend on temperature (up to 400 °C), but in the lack of protective atmosphere, the solder does not wet the pads. Wettability studies of Zn-Al eutectic on aluminum and copper substrates have shown a negative effect of the protective nitrogen atmosphere on the wetting properties, especially for the copper pads. Furthermore, it was noted that with increasing temperature the solder wettability is improved. In addition, densities of liquid solders were studied by means of dilatometric technique. |
| doi_str_mv | 10.1007/s11665-012-0174-7 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_1022868263</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>1022868263</sourcerecordid><originalsourceid>FETCH-LOGICAL-c458t-327cce825ccfd9d2a82e1a3d7a675bf8bac5b7b2f436e6f1c10e922595fe46aa3</originalsourceid><addsrcrecordid>eNp1kE1LAzEQhoMoWKs_wNuCFy_RJJvPYyn1AwoeVIReQjablC3bbE12D_33Zl0PIngIk5l53mHmBeAaozuMkLhPGHPOIMIkP0GhOAEzzCiFGBF6mv-IKaioYufgIqUdyhpC6AyID9f3TdgWnS-WQ2FCXSzaojoWrwFuwne-CTCXVkPvbN_Y3G67Y7oEZ960yV39xDl4f1i9LZ_g-uXxeblYQ0uZ7GFJhLVOEmatr1VNjCQOm7IWhgtWeVkZyypREU9L7rjHFiOnCGGKeUe5MeUc3E5zD7H7HFzq9b5J1rWtCa4bks7nEckl4WVGb_6gu26IIW-XKSSlklyITOGJsrFLKTqvD7HZm3jM0MgJPVmps5V6tFKPGjJpUmbD1sXfk_8TfQFgO3OK</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1008898677</pqid></control><display><type>article</type><title>Wetting of Cu and Al by Sn-Zn and Zn-Al Eutectic Alloys</title><source>SpringerLink Journals - AutoHoldings</source><creator>Pstruś, Janusz ; Fima, Przemysław ; Gancarz, Tomasz</creator><creatorcontrib>Pstruś, Janusz ; Fima, Przemysław ; Gancarz, Tomasz</creatorcontrib><description>Wetting properties of Sn-Zn and Zn-Al alloys on Cu and Al substrates were studied. Spreading tests were carried out for 3 min, in air and under protective atmosphere of nitrogen, with the use of fluxes. In the case of Zn-Al eutectic, spreading tests were carried out at 460, 480, 500, and 520 °C, and in the case of Sn-Zn eutectic at 250, 300, 350, 400, 450, and 500 °C, respectively. Solidified solder/substrate couples were cross-sectioned and subjected to microstructure examination. The spreading tests indicated that the wetting properties of eutectic Sn-Zn alloys, on copper pads do not depend on temperature (up to 400 °C), but in the lack of protective atmosphere, the solder does not wet the pads. Wettability studies of Zn-Al eutectic on aluminum and copper substrates have shown a negative effect of the protective nitrogen atmosphere on the wetting properties, especially for the copper pads. Furthermore, it was noted that with increasing temperature the solder wettability is improved. In addition, densities of liquid solders were studied by means of dilatometric technique.</description><identifier>ISSN: 1059-9495</identifier><identifier>EISSN: 1544-1024</identifier><identifier>DOI: 10.1007/s11665-012-0174-7</identifier><identifier>CODEN: JMEPEG</identifier><language>eng</language><publisher>Boston: Springer US</publisher><subject>Alloys ; Aluminum ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Copper ; Corrosion and Coatings ; Engineering Design ; Eutectic temperature ; Materials Science ; Quality Control ; Reliability ; Safety and Risk ; Solders ; Spreading ; Tribology ; Wettability ; Wetting</subject><ispartof>Journal of materials engineering and performance, 2012-05, Vol.21 (5), p.606-613</ispartof><rights>The Author(s) 2012</rights><rights>ASM International 2012</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c458t-327cce825ccfd9d2a82e1a3d7a675bf8bac5b7b2f436e6f1c10e922595fe46aa3</citedby><cites>FETCH-LOGICAL-c458t-327cce825ccfd9d2a82e1a3d7a675bf8bac5b7b2f436e6f1c10e922595fe46aa3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s11665-012-0174-7$$EPDF$$P50$$Gspringer$$Hfree_for_read</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s11665-012-0174-7$$EHTML$$P50$$Gspringer$$Hfree_for_read</linktohtml><link.rule.ids>314,776,780,27903,27904,41467,42536,51297</link.rule.ids></links><search><creatorcontrib>Pstruś, Janusz</creatorcontrib><creatorcontrib>Fima, Przemysław</creatorcontrib><creatorcontrib>Gancarz, Tomasz</creatorcontrib><title>Wetting of Cu and Al by Sn-Zn and Zn-Al Eutectic Alloys</title><title>Journal of materials engineering and performance</title><addtitle>J. of Materi Eng and Perform</addtitle><description>Wetting properties of Sn-Zn and Zn-Al alloys on Cu and Al substrates were studied. Spreading tests were carried out for 3 min, in air and under protective atmosphere of nitrogen, with the use of fluxes. In the case of Zn-Al eutectic, spreading tests were carried out at 460, 480, 500, and 520 °C, and in the case of Sn-Zn eutectic at 250, 300, 350, 400, 450, and 500 °C, respectively. Solidified solder/substrate couples were cross-sectioned and subjected to microstructure examination. The spreading tests indicated that the wetting properties of eutectic Sn-Zn alloys, on copper pads do not depend on temperature (up to 400 °C), but in the lack of protective atmosphere, the solder does not wet the pads. Wettability studies of Zn-Al eutectic on aluminum and copper substrates have shown a negative effect of the protective nitrogen atmosphere on the wetting properties, especially for the copper pads. Furthermore, it was noted that with increasing temperature the solder wettability is improved. In addition, densities of liquid solders were studied by means of dilatometric technique.</description><subject>Alloys</subject><subject>Aluminum</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Copper</subject><subject>Corrosion and Coatings</subject><subject>Engineering Design</subject><subject>Eutectic temperature</subject><subject>Materials Science</subject><subject>Quality Control</subject><subject>Reliability</subject><subject>Safety and Risk</subject><subject>Solders</subject><subject>Spreading</subject><subject>Tribology</subject><subject>Wettability</subject><subject>Wetting</subject><issn>1059-9495</issn><issn>1544-1024</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2012</creationdate><recordtype>article</recordtype><sourceid>C6C</sourceid><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><recordid>eNp1kE1LAzEQhoMoWKs_wNuCFy_RJJvPYyn1AwoeVIReQjablC3bbE12D_33Zl0PIngIk5l53mHmBeAaozuMkLhPGHPOIMIkP0GhOAEzzCiFGBF6mv-IKaioYufgIqUdyhpC6AyID9f3TdgWnS-WQ2FCXSzaojoWrwFuwne-CTCXVkPvbN_Y3G67Y7oEZ960yV39xDl4f1i9LZ_g-uXxeblYQ0uZ7GFJhLVOEmatr1VNjCQOm7IWhgtWeVkZyypREU9L7rjHFiOnCGGKeUe5MeUc3E5zD7H7HFzq9b5J1rWtCa4bks7nEckl4WVGb_6gu26IIW-XKSSlklyITOGJsrFLKTqvD7HZm3jM0MgJPVmps5V6tFKPGjJpUmbD1sXfk_8TfQFgO3OK</recordid><startdate>20120501</startdate><enddate>20120501</enddate><creator>Pstruś, Janusz</creator><creator>Fima, Przemysław</creator><creator>Gancarz, Tomasz</creator><general>Springer US</general><general>Springer Nature B.V</general><scope>C6C</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7XB</scope><scope>88I</scope><scope>8AF</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M2P</scope><scope>M7S</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope><scope>Q9U</scope><scope>7QF</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20120501</creationdate><title>Wetting of Cu and Al by Sn-Zn and Zn-Al Eutectic Alloys</title><author>Pstruś, Janusz ; Fima, Przemysław ; Gancarz, Tomasz</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c458t-327cce825ccfd9d2a82e1a3d7a675bf8bac5b7b2f436e6f1c10e922595fe46aa3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2012</creationdate><topic>Alloys</topic><topic>Aluminum</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry and Materials Science</topic><topic>Copper</topic><topic>Corrosion and Coatings</topic><topic>Engineering Design</topic><topic>Eutectic temperature</topic><topic>Materials Science</topic><topic>Quality Control</topic><topic>Reliability</topic><topic>Safety and Risk</topic><topic>Solders</topic><topic>Spreading</topic><topic>Tribology</topic><topic>Wettability</topic><topic>Wetting</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Pstruś, Janusz</creatorcontrib><creatorcontrib>Fima, Przemysław</creatorcontrib><creatorcontrib>Gancarz, Tomasz</creatorcontrib><collection>Springer Nature OA Free Journals</collection><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Science Database</collection><collection>Engineering Database</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering Collection</collection><collection>ProQuest Central Basic</collection><collection>Aluminium Industry Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of materials engineering and performance</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Pstruś, Janusz</au><au>Fima, Przemysław</au><au>Gancarz, Tomasz</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Wetting of Cu and Al by Sn-Zn and Zn-Al Eutectic Alloys</atitle><jtitle>Journal of materials engineering and performance</jtitle><stitle>J. of Materi Eng and Perform</stitle><date>2012-05-01</date><risdate>2012</risdate><volume>21</volume><issue>5</issue><spage>606</spage><epage>613</epage><pages>606-613</pages><issn>1059-9495</issn><eissn>1544-1024</eissn><coden>JMEPEG</coden><abstract>Wetting properties of Sn-Zn and Zn-Al alloys on Cu and Al substrates were studied. Spreading tests were carried out for 3 min, in air and under protective atmosphere of nitrogen, with the use of fluxes. In the case of Zn-Al eutectic, spreading tests were carried out at 460, 480, 500, and 520 °C, and in the case of Sn-Zn eutectic at 250, 300, 350, 400, 450, and 500 °C, respectively. Solidified solder/substrate couples were cross-sectioned and subjected to microstructure examination. The spreading tests indicated that the wetting properties of eutectic Sn-Zn alloys, on copper pads do not depend on temperature (up to 400 °C), but in the lack of protective atmosphere, the solder does not wet the pads. Wettability studies of Zn-Al eutectic on aluminum and copper substrates have shown a negative effect of the protective nitrogen atmosphere on the wetting properties, especially for the copper pads. Furthermore, it was noted that with increasing temperature the solder wettability is improved. In addition, densities of liquid solders were studied by means of dilatometric technique.</abstract><cop>Boston</cop><pub>Springer US</pub><doi>10.1007/s11665-012-0174-7</doi><tpages>8</tpages><oa>free_for_read</oa></addata></record> |
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| subjects | Alloys Aluminum Characterization and Evaluation of Materials Chemistry and Materials Science Copper Corrosion and Coatings Engineering Design Eutectic temperature Materials Science Quality Control Reliability Safety and Risk Solders Spreading Tribology Wettability Wetting |
| title | Wetting of Cu and Al by Sn-Zn and Zn-Al Eutectic Alloys |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T19%3A11%3A50IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Wetting%20of%20Cu%20and%20Al%20by%20Sn-Zn%20and%20Zn-Al%20Eutectic%20Alloys&rft.jtitle=Journal%20of%20materials%20engineering%20and%20performance&rft.au=Pstru%C5%9B,%20Janusz&rft.date=2012-05-01&rft.volume=21&rft.issue=5&rft.spage=606&rft.epage=613&rft.pages=606-613&rft.issn=1059-9495&rft.eissn=1544-1024&rft.coden=JMEPEG&rft_id=info:doi/10.1007/s11665-012-0174-7&rft_dat=%3Cproquest_cross%3E1022868263%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=1008898677&rft_id=info:pmid/&rfr_iscdi=true |