A study of large area die bonding materials and their corresponding mechanical and thermal properties

A study of large area die bonding materials and their corresponding mechanical and thermal properties

We tested the ability of Au/Sn eutectic, silver paste, and solder paste to bond to a large area as well as the bonding of a high power LED die to a highly conductive submount. The samples ran through several tests including ultrasound image, shear force, and thermal resistance measurement. Finite el...

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Veröffentlicht in:Microelectronics and reliability 2012-05, Vol.52 (5), p.872-877
Hauptverfasser: Chung, Te-yuan, Jhang, Jian-Hong, Chen, Jing-Sian, Lo, Yi-Chien, Ho, Gwo-Herng, Wu, Mount-Learn, Sun, Ching-Cherng
Format: Artikel
Sprache:eng
Schlagworte:
Bonding
Gold
Heat transfer
Pastes
Silver
Solders
Thermal resistance
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container_end_page 877
container_issue 5
container_start_page 872
container_title Microelectronics and reliability
container_volume 52
creator Chung, Te-yuan
Jhang, Jian-Hong
Chen, Jing-Sian
Lo, Yi-Chien
Ho, Gwo-Herng
Wu, Mount-Learn
Sun, Ching-Cherng
description We tested the ability of Au/Sn eutectic, silver paste, and solder paste to bond to a large area as well as the bonding of a high power LED die to a highly conductive submount. The samples ran through several tests including ultrasound image, shear force, and thermal resistance measurement. Finite element analysis (FEA) models were built for comparison and analysis. Au/Sn bonding shows the best thermal and mechanical properties. Silver paste shows lower contact thermal resistance compared with solder paste. Although the thickness of the silver paste bonding layer is greater than the solder paste bonding layer, the average total thermal resistance is noticeably lower than the solder paste bonded samples.
doi_str_mv 10.1016/j.microrel.2011.03.029
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subjects Bonding
Gold
Heat transfer
Pastes
Silver
Solders
Thermal resistance
title A study of large area die bonding materials and their corresponding mechanical and thermal properties
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