Surfactant controlled interfacial alloying in thermally evaporated Cu/Co multilayers

[Display omitted] ► Cu/Co multilayers were prepared using Ag surfactant. ► Ag surfactant results in smooth and symmetric Cu-on-Co and Co-on-Cu interfaces. Ag surfactant inhibits the interdiffusion across interfaces. ► Intermixed Cu–Co alloys are formed when no surfactant is added. ► By adding Ag sur...

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Veröffentlicht in:	Journal of alloys and compounds 2012-05, Vol.522, p.9-13
Hauptverfasser:	Amir, S.M., Gupta, Mukul, Gupta, Ajay
Format:	Artikel
Sprache:	eng
Schlagworte:	ALLOYING Alloying effects ANNEALING PROCESSES Asymmetry Condensed matter: structure, mechanical and thermal properties Copper COPPER COBALT ALLOYS Cross-disciplinary physics: materials science rheology CuCo alloys CuCo multilayers Diffusion interface formation E-beam evaporation Exact sciences and technology FREE ENERGY FREE ENERGY OF FORMATION INTERFACES INTERLAYERS Materials science Methods of deposition of films and coatings film growth and epitaxy Molecular, atomic, ion, and chemical beam epitaxy Multilayers Physics Silver Solid surfaces and solid-solid interfaces Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) SURFACTANTS THIN FILMS X-ray reflectivity
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