Thermal analysis of high power LED packages under the alternating current operation
► We report on both experimental and analytical thermal analysis of AC driven LED packages. ► The variation of R th with the input power can be attributed to the h effect. ► The thermal resistance of AC driven LED can be lower than that from DC mode. In this paper we describe a novel thermal charact...
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| Veröffentlicht in: | Solid-state electronics 2012-02, Vol.68, p.48-50 |
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| creator | Shin, Moo Whan Jang, Sun Ho |
| description | ► We report on both experimental and analytical thermal analysis of AC driven LED packages. ► The variation of
R
th
with the input power can be attributed to the
h effect. ► The thermal resistance of AC driven LED can be lower than that from DC mode.
In this paper we describe a novel thermal characterization method of GaN-based Light Emitting Diode (LED) package driven under the Alternating Current (AC) mode. The result was compared with the results from the thermal analysis for LED package operated under the Direct Current (DC) condition. Different from the DC condition, the junction temperature rise with the operation time of LED package was exhibited in a band formation. Finite Volume Method (FVM) was utilized to calculate the thermal performance of LED package under the AC condition using the input power extracted from the output current and voltage from the AC power supply. The experimental result was in a good agreement with the simulation data. |
| doi_str_mv | 10.1016/j.sse.2011.10.033 |
| format | Article |
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R
th
with the input power can be attributed to the
h effect. ► The thermal resistance of AC driven LED can be lower than that from DC mode.
In this paper we describe a novel thermal characterization method of GaN-based Light Emitting Diode (LED) package driven under the Alternating Current (AC) mode. The result was compared with the results from the thermal analysis for LED package operated under the Direct Current (DC) condition. Different from the DC condition, the junction temperature rise with the operation time of LED package was exhibited in a band formation. Finite Volume Method (FVM) was utilized to calculate the thermal performance of LED package under the AC condition using the input power extracted from the output current and voltage from the AC power supply. The experimental result was in a good agreement with the simulation data.</description><identifier>ISSN: 0038-1101</identifier><identifier>EISSN: 1879-2405</identifier><identifier>DOI: 10.1016/j.sse.2011.10.033</identifier><language>eng</language><publisher>Kidlington: Elsevier Ltd</publisher><subject>Alternating current ; Applied sciences ; Design. Technologies. Operation analysis. Testing ; Direct current ; Effective power ; Electrical engineering. Electrical power engineering ; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics ; Electronics ; Exact sciences and technology ; Integrated circuits ; LED ; Light-emitting diodes ; Mathematical analysis ; Optoelectronic devices ; Packages ; Power electronics, power supplies ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Thermal analysis ; Thermal resistance ; Voltage</subject><ispartof>Solid-state electronics, 2012-02, Vol.68, p.48-50</ispartof><rights>2011 Elsevier Ltd</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c426t-881582e59c18d2cf6845b7ee26ac7eef8876588cd1096ff04a110d6ea854609c3</citedby><cites>FETCH-LOGICAL-c426t-881582e59c18d2cf6845b7ee26ac7eef8876588cd1096ff04a110d6ea854609c3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.sse.2011.10.033$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3548,27923,27924,45994</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=25424799$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Shin, Moo Whan</creatorcontrib><creatorcontrib>Jang, Sun Ho</creatorcontrib><title>Thermal analysis of high power LED packages under the alternating current operation</title><title>Solid-state electronics</title><description>► We report on both experimental and analytical thermal analysis of AC driven LED packages. ► The variation of
R
th
with the input power can be attributed to the
h effect. ► The thermal resistance of AC driven LED can be lower than that from DC mode.
In this paper we describe a novel thermal characterization method of GaN-based Light Emitting Diode (LED) package driven under the Alternating Current (AC) mode. The result was compared with the results from the thermal analysis for LED package operated under the Direct Current (DC) condition. Different from the DC condition, the junction temperature rise with the operation time of LED package was exhibited in a band formation. Finite Volume Method (FVM) was utilized to calculate the thermal performance of LED package under the AC condition using the input power extracted from the output current and voltage from the AC power supply. The experimental result was in a good agreement with the simulation data.</description><subject>Alternating current</subject><subject>Applied sciences</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Direct current</subject><subject>Effective power</subject><subject>Electrical engineering. Electrical power engineering</subject><subject>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Integrated circuits</subject><subject>LED</subject><subject>Light-emitting diodes</subject><subject>Mathematical analysis</subject><subject>Optoelectronic devices</subject><subject>Packages</subject><subject>Power electronics, power supplies</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Thermal analysis</subject><subject>Thermal resistance</subject><subject>Voltage</subject><issn>0038-1101</issn><issn>1879-2405</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2012</creationdate><recordtype>article</recordtype><recordid>eNp9kD9PwzAQxS0EEqXwAdi8ILEk2E7iOGJCUP5IlRgos2Wcc-OS2sFOQf32uGrFyHS6p9-9u3sIXVKSU0L5zSqPEXJGKE19ToriCE2oqJuMlaQ6RhNCCpHRhJ6isxhXhBDGKZmgt0UHYa16rJzqt9FG7A3u7LLDg_-BgOezBzwo_amWEPHGtUkaO8CqHyE4NVq3xHoTArgR-wFCUrw7RydG9REuDnWK3h9ni_vnbP769HJ_N890yfiYCUErwaBqNBUt04aLsvqoARhXOhUjRM0rIXRLScONIaVK97cclKhKThpdTNH13ncI_msDcZRrGzX0vXLgN1Gmb0kyYYImlO5RHXyMAYwcgl2rsE3QjuNyJVOAchfgTkoBppmrg72KWvUmKKdt_BtkVcnKumkSd7vnIP36bSHIqC04Da0NoEfZevvPll_ZB4Vz</recordid><startdate>20120201</startdate><enddate>20120201</enddate><creator>Shin, Moo Whan</creator><creator>Jang, Sun Ho</creator><general>Elsevier Ltd</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope></search><sort><creationdate>20120201</creationdate><title>Thermal analysis of high power LED packages under the alternating current operation</title><author>Shin, Moo Whan ; Jang, Sun Ho</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c426t-881582e59c18d2cf6845b7ee26ac7eef8876588cd1096ff04a110d6ea854609c3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2012</creationdate><topic>Alternating current</topic><topic>Applied sciences</topic><topic>Design. Technologies. Operation analysis. Testing</topic><topic>Direct current</topic><topic>Effective power</topic><topic>Electrical engineering. Electrical power engineering</topic><topic>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Integrated circuits</topic><topic>LED</topic><topic>Light-emitting diodes</topic><topic>Mathematical analysis</topic><topic>Optoelectronic devices</topic><topic>Packages</topic><topic>Power electronics, power supplies</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Thermal analysis</topic><topic>Thermal resistance</topic><topic>Voltage</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Shin, Moo Whan</creatorcontrib><creatorcontrib>Jang, Sun Ho</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Solid-state electronics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Shin, Moo Whan</au><au>Jang, Sun Ho</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Thermal analysis of high power LED packages under the alternating current operation</atitle><jtitle>Solid-state electronics</jtitle><date>2012-02-01</date><risdate>2012</risdate><volume>68</volume><spage>48</spage><epage>50</epage><pages>48-50</pages><issn>0038-1101</issn><eissn>1879-2405</eissn><abstract>► We report on both experimental and analytical thermal analysis of AC driven LED packages. ► The variation of
R
th
with the input power can be attributed to the
h effect. ► The thermal resistance of AC driven LED can be lower than that from DC mode.
In this paper we describe a novel thermal characterization method of GaN-based Light Emitting Diode (LED) package driven under the Alternating Current (AC) mode. The result was compared with the results from the thermal analysis for LED package operated under the Direct Current (DC) condition. Different from the DC condition, the junction temperature rise with the operation time of LED package was exhibited in a band formation. Finite Volume Method (FVM) was utilized to calculate the thermal performance of LED package under the AC condition using the input power extracted from the output current and voltage from the AC power supply. The experimental result was in a good agreement with the simulation data.</abstract><cop>Kidlington</cop><pub>Elsevier Ltd</pub><doi>10.1016/j.sse.2011.10.033</doi><tpages>3</tpages></addata></record> |
| fulltext | fulltext |
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| ispartof | Solid-state electronics, 2012-02, Vol.68, p.48-50 |
| issn | 0038-1101 1879-2405 |
| language | eng |
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| source | ScienceDirect Journals (5 years ago - present) |
| subjects | Alternating current Applied sciences Design. Technologies. Operation analysis. Testing Direct current Effective power Electrical engineering. Electrical power engineering Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Integrated circuits LED Light-emitting diodes Mathematical analysis Optoelectronic devices Packages Power electronics, power supplies Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Thermal analysis Thermal resistance Voltage |
| title | Thermal analysis of high power LED packages under the alternating current operation |
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