Investigation of photoluminescence efficiency of n-type porous silicon by controlling of etching times and applied current densities

The change of photoluminescence intensities of porous silicon and their morphologies during the etching procedure were investigated. [Display omitted] ► Photoluminescence and surface morphology of porous silicon was investigated. ► The porous silicon prepared with low currents exhibited very stable...

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Veröffentlicht in:Microelectronic engineering 2012, Vol.89, p.92-96
Hauptverfasser: Cho, Bomin, Jin, Sunghoon, Lee, Bo-Yeon, Hwang, Minwoo, Kim, Hee-Cheol, Sohn, Honglae
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container_end_page 96
container_issue
container_start_page 92
container_title Microelectronic engineering
container_volume 89
creator Cho, Bomin
Jin, Sunghoon
Lee, Bo-Yeon
Hwang, Minwoo
Kim, Hee-Cheol
Sohn, Honglae
description The change of photoluminescence intensities of porous silicon and their morphologies during the etching procedure were investigated. [Display omitted] ► Photoluminescence and surface morphology of porous silicon was investigated. ► The porous silicon prepared with low currents exhibited very stable and even surface. ► The porous silicon prepared with high displayed the cracked surface of porous silicon. ► The photoluminescence efficiency increased as an etching time increased. Photoluminescence properties and surface morphologies of porous silicon were investigated by controlling of etching times and applied current densities. FE-SEM image of porous silicon surface indicated that the porous silicon prepared at currents below 200 mA/cm 2 exhibited very stable and even surface. However the porous silicon prepared at currents above 300 mA/cm 2 displayed the cracked surface of porous silicon. This cracked surface was collapsed to give cracked domains at currents over 500 mA/cm 2. Photoluminescence of porous silicon was investigated by controlling of etching times and applied current densities in the range from 50 to 900 s and from 50 to 800 mA/cm 2, respectively. Photoluminescence intensity of porous silicon increased gradually during etching process, reached maximum, and then decreased as the etching time increased. Porous silicon showed the best photoluminescence efficiency was prepared at currents of 200 mA/cm 2 and etching time of 300 s.
doi_str_mv 10.1016/j.mee.2011.03.145
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[Display omitted] ► Photoluminescence and surface morphology of porous silicon was investigated. ► The porous silicon prepared with low currents exhibited very stable and even surface. ► The porous silicon prepared with high displayed the cracked surface of porous silicon. ► The photoluminescence efficiency increased as an etching time increased. Photoluminescence properties and surface morphologies of porous silicon were investigated by controlling of etching times and applied current densities. FE-SEM image of porous silicon surface indicated that the porous silicon prepared at currents below 200 mA/cm 2 exhibited very stable and even surface. However the porous silicon prepared at currents above 300 mA/cm 2 displayed the cracked surface of porous silicon. This cracked surface was collapsed to give cracked domains at currents over 500 mA/cm 2. Photoluminescence of porous silicon was investigated by controlling of etching times and applied current densities in the range from 50 to 900 s and from 50 to 800 mA/cm 2, respectively. Photoluminescence intensity of porous silicon increased gradually during etching process, reached maximum, and then decreased as the etching time increased. 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[Display omitted] ► Photoluminescence and surface morphology of porous silicon was investigated. ► The porous silicon prepared with low currents exhibited very stable and even surface. ► The porous silicon prepared with high displayed the cracked surface of porous silicon. ► The photoluminescence efficiency increased as an etching time increased. Photoluminescence properties and surface morphologies of porous silicon were investigated by controlling of etching times and applied current densities. FE-SEM image of porous silicon surface indicated that the porous silicon prepared at currents below 200 mA/cm 2 exhibited very stable and even surface. However the porous silicon prepared at currents above 300 mA/cm 2 displayed the cracked surface of porous silicon. This cracked surface was collapsed to give cracked domains at currents over 500 mA/cm 2. 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granular materials</topic><topic>Porous silicon</topic><topic>Solid surfaces and solid-solid interfaces</topic><topic>Specific materials</topic><topic>Surface</topic><topic>Surface structure and topography</topic><topic>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Cho, Bomin</creatorcontrib><creatorcontrib>Jin, Sunghoon</creatorcontrib><creatorcontrib>Lee, Bo-Yeon</creatorcontrib><creatorcontrib>Hwang, Minwoo</creatorcontrib><creatorcontrib>Kim, Hee-Cheol</creatorcontrib><creatorcontrib>Sohn, Honglae</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics &amp; Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Microelectronic engineering</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Cho, Bomin</au><au>Jin, Sunghoon</au><au>Lee, Bo-Yeon</au><au>Hwang, Minwoo</au><au>Kim, Hee-Cheol</au><au>Sohn, Honglae</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Investigation of photoluminescence efficiency of n-type porous silicon by controlling of etching times and applied current densities</atitle><jtitle>Microelectronic engineering</jtitle><date>2012</date><risdate>2012</risdate><volume>89</volume><spage>92</spage><epage>96</epage><pages>92-96</pages><issn>0167-9317</issn><eissn>1873-5568</eissn><coden>MIENEF</coden><abstract>The change of photoluminescence intensities of porous silicon and their morphologies during the etching procedure were investigated. [Display omitted] ► Photoluminescence and surface morphology of porous silicon was investigated. ► The porous silicon prepared with low currents exhibited very stable and even surface. ► The porous silicon prepared with high displayed the cracked surface of porous silicon. ► The photoluminescence efficiency increased as an etching time increased. Photoluminescence properties and surface morphologies of porous silicon were investigated by controlling of etching times and applied current densities. FE-SEM image of porous silicon surface indicated that the porous silicon prepared at currents below 200 mA/cm 2 exhibited very stable and even surface. However the porous silicon prepared at currents above 300 mA/cm 2 displayed the cracked surface of porous silicon. This cracked surface was collapsed to give cracked domains at currents over 500 mA/cm 2. 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subjects Condensed matter: electronic structure, electrical, magnetic, and optical properties
Condensed matter: structure, mechanical and thermal properties
Control surfaces
Cross-disciplinary physics: materials science
rheology
Current density
Efficiency
Etching
Exact sciences and technology
Iron
Materials science
Microelectronics
Morphology
Optical properties and condensed-matter spectroscopy and other interactions of matter with particles and radiation
Optical properties of low-dimensional, mesoscopic, and nanoscale materials and structures
Photoluminescence
Physics
Porous materials
granular materials
Porous silicon
Solid surfaces and solid-solid interfaces
Specific materials
Surface
Surface structure and topography
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
title Investigation of photoluminescence efficiency of n-type porous silicon by controlling of etching times and applied current densities
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