Manufacturable GaAs VFET for power switching applications

We have developed a manufacturable process to fabricate high performance GaAs vertical field effect transistors (VFET's). Our process uses ion implantation to form the gate as opposed to previous VFET processes, which used epitaxial regrowth or angled evaporation. In this process, trenches 1.2...

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Veröffentlicht in:IEEE electron device letters 2000-04, Vol.21 (4), p.144-145
Hauptverfasser: Eisenbeiser, K., Jenn-Hwa Huang, Salih, A., Hadizad, P., Pitts, B.
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container_end_page 145
container_issue 4
container_start_page 144
container_title IEEE electron device letters
container_volume 21
creator Eisenbeiser, K.
Jenn-Hwa Huang
Salih, A.
Hadizad, P.
Pitts, B.
description We have developed a manufacturable process to fabricate high performance GaAs vertical field effect transistors (VFET's). Our process uses ion implantation to form the gate as opposed to previous VFET processes, which used epitaxial regrowth or angled evaporation. In this process, trenches 1.2 μm wide by 0.6 μm deep with a period of 2.4 μm are formed by reactive ion etch (RIE) then the gate region is formed at the bottom of the trench by Ar/C ion co-implantation. Current handling capability of these devices exceeds 200 A/cm 2 with a specific on-resistance of 0.25 m/spl Omega/-cm 2 and calculated delay times of 13.9 ps.
doi_str_mv 10.1109/55.830962
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subjects Argon
Costs
Delay
Devices
Epitaxial growth
Etching
Evaporation
FETs
Gallium arsenide
Gallium arsenides
Gates
Laboratories
Manufacturing
Mathematical analysis
Resists
Switches
Trenches
title Manufacturable GaAs VFET for power switching applications
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