Developing a model for the bond heel lifetime prediction of thick aluminium wire bonds

Purpose - The purpose of this paper is to establish a law on the durability of thick aluminium wire bonds in low cycle fatigue for different geometries and wire diameters under a purely mechanical load.Design methodology approach - Bond wires with different geometries were tested with various loads...

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Veröffentlicht in:Soldering & surface mount technology 2012-01, Vol.24 (2), p.127-134
Hauptverfasser: Merkle, Lutz, Sonner, Marcus, Petzold, Matthias
Format: Artikel
Sprache:eng
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