Proximity communication
This paper reports results from wireless chip-to-chip communication experiments. Sixteen bit words pass from one chip to another in parallel without detectable error at 1.35 billion data items per second for a total data rate of 21.6 Gigabits per second. The experiment transmits pseudo random patter...
Gespeichert in:
| Veröffentlicht in: | IEEE journal of solid-state circuits 2004-09, Vol.39 (9), p.1529-1535 |
|---|---|
| Hauptverfasser: | , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 1535 |
|---|---|
| container_issue | 9 |
| container_start_page | 1529 |
| container_title | IEEE journal of solid-state circuits |
| container_volume | 39 |
| creator | Drost, R.J. Hopkins, R.D. Ho, R. Sutherland, I.E. |
| description | This paper reports results from wireless chip-to-chip communication experiments. Sixteen bit words pass from one chip to another in parallel without detectable error at 1.35 billion data items per second for a total data rate of 21.6 Gigabits per second. The experiment transmits pseudo random patterns between chips built in a 350-nm CMOS technology. Chips touch face-to-face to communicate. The same pseudorandom data pattern is loaded onto both chips so that the receiving chip can check the accuracy of every bit communicated. Each communication channel consumes a static power of 3.6 mW, and a dynamic power of 3.9 pJ per bit communicated. The channels lie on 50-/spl mu/m centers. Because the capacitive communication works through covering oxide, ESD protection is unnecessary. Vernier position measuring circuits built into the chips indicate the relative position of transmitting and receiving arrays to assist mechanical alignment. The test chip includes a Vernier measurement circuit that provides inter-chip position measurements with a resolution of 1.4 /spl mu/m. |
| doi_str_mv | 10.1109/JSSC.2004.831448 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_proquest_journals_921355845</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1327751</ieee_id><sourcerecordid>28531427</sourcerecordid><originalsourceid>FETCH-LOGICAL-c381t-e16af5964257efde9637689c51fa03f323dc80acc342a2da1d9c446c4e3ef3f83</originalsourceid><addsrcrecordid>eNp9kE1LAzEQhoMoWKtnBS8iqKetmUx2NzlK8ZOCQhW8hZBNIGU_arIL9t-bsgXBg6dhmOd9YR5CzoDOAKi8fVku5zNGKZ8JBM7FHplAnosMSvzcJxNKQWQy3Q_JUYyrtCYGJuT0LXTfvvH95sJ0TTO03ujed-0xOXC6jvZkN6fk4-H-ff6ULV4fn-d3i8yggD6zUGiXy4KzvLSusrLAshDS5OA0RYcMKyOoNgY506zSUEnDeWG4RevQCZySm7F3HbqvwcZeNT4aW9e6td0QlZAFo4ipd0qu_yWZyNPjrEzg5R9w1Q2hTV8oyQCTFJ4niI6QCV2MwTq1Dr7RYaOAqq1QtRWqtkLVKDRFrna9Ohpdu6Bb4-NvroAyBSFx5yPnrbW_Z2RlmQP-ANjWfC4</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>921355845</pqid></control><display><type>article</type><title>Proximity communication</title><source>IEEE Electronic Library (IEL)</source><creator>Drost, R.J. ; Hopkins, R.D. ; Ho, R. ; Sutherland, I.E.</creator><creatorcontrib>Drost, R.J. ; Hopkins, R.D. ; Ho, R. ; Sutherland, I.E.</creatorcontrib><description>This paper reports results from wireless chip-to-chip communication experiments. Sixteen bit words pass from one chip to another in parallel without detectable error at 1.35 billion data items per second for a total data rate of 21.6 Gigabits per second. The experiment transmits pseudo random patterns between chips built in a 350-nm CMOS technology. Chips touch face-to-face to communicate. The same pseudorandom data pattern is loaded onto both chips so that the receiving chip can check the accuracy of every bit communicated. Each communication channel consumes a static power of 3.6 mW, and a dynamic power of 3.9 pJ per bit communicated. The channels lie on 50-/spl mu/m centers. Because the capacitive communication works through covering oxide, ESD protection is unnecessary. Vernier position measuring circuits built into the chips indicate the relative position of transmitting and receiving arrays to assist mechanical alignment. The test chip includes a Vernier measurement circuit that provides inter-chip position measurements with a resolution of 1.4 /spl mu/m.</description><identifier>ISSN: 0018-9200</identifier><identifier>EISSN: 1558-173X</identifier><identifier>DOI: 10.1109/JSSC.2004.831448</identifier><identifier>CODEN: IJSCBC</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>Applied sciences ; Arrays ; Channels ; Chips ; Circuit testing ; Circuits ; CMOS technology ; Communication channels ; Consumption ; Design. Technologies. Operation analysis. Testing ; Electronics ; Electrostatic discharge ; Error detection ; Exact sciences and technology ; Face detection ; Integrated circuits ; Mechanical variables measurement ; Position measurement ; Protection ; Receiving ; Semiconductor device measurement ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Wireless communication</subject><ispartof>IEEE journal of solid-state circuits, 2004-09, Vol.39 (9), p.1529-1535</ispartof><rights>2004 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2004</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c381t-e16af5964257efde9637689c51fa03f323dc80acc342a2da1d9c446c4e3ef3f83</citedby><cites>FETCH-LOGICAL-c381t-e16af5964257efde9637689c51fa03f323dc80acc342a2da1d9c446c4e3ef3f83</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1327751$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,796,27924,27925,54758</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1327751$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=16171101$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Drost, R.J.</creatorcontrib><creatorcontrib>Hopkins, R.D.</creatorcontrib><creatorcontrib>Ho, R.</creatorcontrib><creatorcontrib>Sutherland, I.E.</creatorcontrib><title>Proximity communication</title><title>IEEE journal of solid-state circuits</title><addtitle>JSSC</addtitle><description>This paper reports results from wireless chip-to-chip communication experiments. Sixteen bit words pass from one chip to another in parallel without detectable error at 1.35 billion data items per second for a total data rate of 21.6 Gigabits per second. The experiment transmits pseudo random patterns between chips built in a 350-nm CMOS technology. Chips touch face-to-face to communicate. The same pseudorandom data pattern is loaded onto both chips so that the receiving chip can check the accuracy of every bit communicated. Each communication channel consumes a static power of 3.6 mW, and a dynamic power of 3.9 pJ per bit communicated. The channels lie on 50-/spl mu/m centers. Because the capacitive communication works through covering oxide, ESD protection is unnecessary. Vernier position measuring circuits built into the chips indicate the relative position of transmitting and receiving arrays to assist mechanical alignment. The test chip includes a Vernier measurement circuit that provides inter-chip position measurements with a resolution of 1.4 /spl mu/m.</description><subject>Applied sciences</subject><subject>Arrays</subject><subject>Channels</subject><subject>Chips</subject><subject>Circuit testing</subject><subject>Circuits</subject><subject>CMOS technology</subject><subject>Communication channels</subject><subject>Consumption</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Electronics</subject><subject>Electrostatic discharge</subject><subject>Error detection</subject><subject>Exact sciences and technology</subject><subject>Face detection</subject><subject>Integrated circuits</subject><subject>Mechanical variables measurement</subject><subject>Position measurement</subject><subject>Protection</subject><subject>Receiving</subject><subject>Semiconductor device measurement</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Wireless communication</subject><issn>0018-9200</issn><issn>1558-173X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2004</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNp9kE1LAzEQhoMoWKtnBS8iqKetmUx2NzlK8ZOCQhW8hZBNIGU_arIL9t-bsgXBg6dhmOd9YR5CzoDOAKi8fVku5zNGKZ8JBM7FHplAnosMSvzcJxNKQWQy3Q_JUYyrtCYGJuT0LXTfvvH95sJ0TTO03ujed-0xOXC6jvZkN6fk4-H-ff6ULV4fn-d3i8yggD6zUGiXy4KzvLSusrLAshDS5OA0RYcMKyOoNgY506zSUEnDeWG4RevQCZySm7F3HbqvwcZeNT4aW9e6td0QlZAFo4ipd0qu_yWZyNPjrEzg5R9w1Q2hTV8oyQCTFJ4niI6QCV2MwTq1Dr7RYaOAqq1QtRWqtkLVKDRFrna9Ohpdu6Bb4-NvroAyBSFx5yPnrbW_Z2RlmQP-ANjWfC4</recordid><startdate>20040901</startdate><enddate>20040901</enddate><creator>Drost, R.J.</creator><creator>Hopkins, R.D.</creator><creator>Ho, R.</creator><creator>Sutherland, I.E.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>RIA</scope><scope>RIE</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>F28</scope><scope>FR3</scope></search><sort><creationdate>20040901</creationdate><title>Proximity communication</title><author>Drost, R.J. ; Hopkins, R.D. ; Ho, R. ; Sutherland, I.E.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c381t-e16af5964257efde9637689c51fa03f323dc80acc342a2da1d9c446c4e3ef3f83</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Applied sciences</topic><topic>Arrays</topic><topic>Channels</topic><topic>Chips</topic><topic>Circuit testing</topic><topic>Circuits</topic><topic>CMOS technology</topic><topic>Communication channels</topic><topic>Consumption</topic><topic>Design. Technologies. Operation analysis. Testing</topic><topic>Electronics</topic><topic>Electrostatic discharge</topic><topic>Error detection</topic><topic>Exact sciences and technology</topic><topic>Face detection</topic><topic>Integrated circuits</topic><topic>Mechanical variables measurement</topic><topic>Position measurement</topic><topic>Protection</topic><topic>Receiving</topic><topic>Semiconductor device measurement</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Wireless communication</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Drost, R.J.</creatorcontrib><creatorcontrib>Hopkins, R.D.</creatorcontrib><creatorcontrib>Ho, R.</creatorcontrib><creatorcontrib>Sutherland, I.E.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><jtitle>IEEE journal of solid-state circuits</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Drost, R.J.</au><au>Hopkins, R.D.</au><au>Ho, R.</au><au>Sutherland, I.E.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Proximity communication</atitle><jtitle>IEEE journal of solid-state circuits</jtitle><stitle>JSSC</stitle><date>2004-09-01</date><risdate>2004</risdate><volume>39</volume><issue>9</issue><spage>1529</spage><epage>1535</epage><pages>1529-1535</pages><issn>0018-9200</issn><eissn>1558-173X</eissn><coden>IJSCBC</coden><abstract>This paper reports results from wireless chip-to-chip communication experiments. Sixteen bit words pass from one chip to another in parallel without detectable error at 1.35 billion data items per second for a total data rate of 21.6 Gigabits per second. The experiment transmits pseudo random patterns between chips built in a 350-nm CMOS technology. Chips touch face-to-face to communicate. The same pseudorandom data pattern is loaded onto both chips so that the receiving chip can check the accuracy of every bit communicated. Each communication channel consumes a static power of 3.6 mW, and a dynamic power of 3.9 pJ per bit communicated. The channels lie on 50-/spl mu/m centers. Because the capacitive communication works through covering oxide, ESD protection is unnecessary. Vernier position measuring circuits built into the chips indicate the relative position of transmitting and receiving arrays to assist mechanical alignment. The test chip includes a Vernier measurement circuit that provides inter-chip position measurements with a resolution of 1.4 /spl mu/m.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/JSSC.2004.831448</doi><tpages>7</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 0018-9200 |
| ispartof | IEEE journal of solid-state circuits, 2004-09, Vol.39 (9), p.1529-1535 |
| issn | 0018-9200 1558-173X |
| language | eng |
| recordid | cdi_proquest_journals_921355845 |
| source | IEEE Electronic Library (IEL) |
| subjects | Applied sciences Arrays Channels Chips Circuit testing Circuits CMOS technology Communication channels Consumption Design. Technologies. Operation analysis. Testing Electronics Electrostatic discharge Error detection Exact sciences and technology Face detection Integrated circuits Mechanical variables measurement Position measurement Protection Receiving Semiconductor device measurement Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Wireless communication |
| title | Proximity communication |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-21T13%3A56%3A16IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Proximity%20communication&rft.jtitle=IEEE%20journal%20of%20solid-state%20circuits&rft.au=Drost,%20R.J.&rft.date=2004-09-01&rft.volume=39&rft.issue=9&rft.spage=1529&rft.epage=1535&rft.pages=1529-1535&rft.issn=0018-9200&rft.eissn=1558-173X&rft.coden=IJSCBC&rft_id=info:doi/10.1109/JSSC.2004.831448&rft_dat=%3Cproquest_RIE%3E28531427%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=921355845&rft_id=info:pmid/&rft_ieee_id=1327751&rfr_iscdi=true |