Self-alignment of Silicon Chips on Wafers: a Numerical Investigation of the Effect of Spreading and Wetting

3D integration is the key to advanced microelectronic systems. Die-to-wafer assembly is a necessary step to reach full integration. Self-assembly methods are promising due to their parallel aspect, which overcomes the main difficulties of the current techniques. Especially promising are the self-ass...

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Veröffentlicht in:	Sensors & transducers 2011-12, Vol.13, p.44
Hauptverfasser:	Berthier, Jean, Brakke, Kenneth, Mermoz, Sébastien, Sanchez, Loïc, Fretigny, Christian, Di Cioccio, Léa
Format:	Artikel
Sprache:	eng
Schlagworte:	Asymmetry Experiments Methods Numerical analysis Studies
Online-Zugang:	Volltext
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