Development of Embedded Heatsinking Layers for Compact Arrays of X-Ray TES Microcalorimeters

Transition-edge sensor microcalorimeter arrays in compact geometries and large formats experience local heating from bias power and x-ray hits that must be dissipated in the frame. For devices on solid, non-perforated silicon substrates, we have introduced an underlying embedded copper heatsinking l...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	IEEE transactions on applied superconductivity 2011-06, Vol.21 (3), p.223-226
Hauptverfasser:	Finkbeiner, F M, Bailey, C N, Bandler, S R, Brekosky, R P, Brown, A D, Chervenak, J A, Eckart, M E, Kelley, R L, Kelly, D P, Kilbourne, C A, Porter, F S, Sadleir, J E, Smith, S J
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Arrays Compound structure devices Copper Diffusion barrier Diffusion barriers Electrical engineering. Electrical power engineering Electromagnets Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Frames Ground plane Heating heatsinking Microcalorimeters Microelectronic fabrication (materials and surfaces technology) Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Silicon Substrates superconducting Superconducting epitaxial layers Superconductivity Temperature measurement Various equipment and components x-ray microcalorimeter X-rays
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!