Measurement and prediction of contact angles of Pb-free Sn-Ag solder alloys on Cu substrate

The contact angle (Θ) of molten Sn and Sn-Ag alloys (0.5, 1.5, 3.5, 6 wt.% Ag) on Cu substrates have been studied by using sessile drop method at various temperatures (230, 250, 275 and 300 °C). Experimental results showed that additions of Ag to Sn resulted in a continuous decrease in the Θ up to 3...

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Veröffentlicht in:	European physical journal. Applied physics 2011-04, Vol.54 (1), p.11302
Hauptverfasser:	Erer, A. M., Candan, E., Güven, M. H., Turen, Y.
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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