Inclusion of Chemical-Mechanical Polishing Variation in Statistical Static Timing Analysis

Technology trends show the importance of modeling process variation in static timing analysis. With the advent of statistical static timing analysis (SSTA), multiple independent sources of variation can be modeled. This paper proposes a methodology for modeling metal interconnect process variation i...

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Veröffentlicht in:	IEEE transactions on computer-aided design of integrated circuits and systems 2011-11, Vol.30 (11), p.1758-1762
Hauptverfasser:	Foreman, E. A., Habitz, P. A., Cheng, M-C, Tamon, C.
Format:	Artikel
Sprache:	eng
Schlagworte:	Application specific integrated circuits Capacitance Chemical-mechanical polishing Computer aided design Design engineering Integrated circuit interconnections Integrated circuit modeling Integrated circuits Mathematical models Methodology semiconductor-metal interfaces Static timing analysis timing circuits Trends
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