Reaction diffusions of Cu6Sn5 and Cu3Sn intermetallic compound in the couple of Sn-3.5Ag eutectic solder and copper substrate

Reaction diffusions of Cu6Sn5 and Cu3Sn intermetallic compound in the couple of Sn-3.5Ag eutectic solder and copper substrate

The growth kinetics of intermetallic compound layers formed between Sn-3.5Ag solder and Cu substrate were investigated as a consequence of solid-state isothermal aging. Isothermal aging was carried out in a temperature range between 70°C and 200°C for 0 to 60 days. A quantitative analysis of the int...

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Veröffentlicht in:Metals and materials (Seoul, Korea) Korea), 2003-04, Vol.9 (2), p.193-199
Hauptverfasser: Yoon, Jeong -Won, Lee, Chang -Bae, Kim, Dae -Up, Jung, Seung -Boo
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Sprache:eng
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Alloys
Copper
Diffusion layers
Intermetallic compounds
Kinetics
Solders
Substrates
Thickness
Tin base alloys
Tin compounds
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Lee, Chang -Bae
Kim, Dae -Up
Jung, Seung -Boo
description The growth kinetics of intermetallic compound layers formed between Sn-3.5Ag solder and Cu substrate were investigated as a consequence of solid-state isothermal aging. Isothermal aging was carried out in a temperature range between 70°C and 200°C for 0 to 60 days. A quantitative analysis of the intermetallic compound layer thickness as a function of time and temperature was performed. The diffusion couples showed a composite intermetallic layer comprised of Cu6Sn5 and Cu3Sn. The growth of intermetallic compounds followed diffusion-controlled kinetics and the layer thickness reached only 9 μm after 60 day of aging at 150°C. The apparent activation energies were calculated for the growth of the total intermetallic compound (Cu6Sn5+Cu3Sn); Cu6Sn5 and Cu3Sn intermetallic are 65.4, 55.4 and 75.7 kJ/mol, respectively.
doi_str_mv 10.1007/BF03027277
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1225-9438
2005-4149
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subjects Alloys
Copper
Diffusion layers
Intermetallic compounds
Kinetics
Solders
Substrates
Thickness
Tin base alloys
Tin compounds
title Reaction diffusions of Cu6Sn5 and Cu3Sn intermetallic compound in the couple of Sn-3.5Ag eutectic solder and copper substrate
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