Reliability evaluations of under bump metallurgy in two solder systems
Under bump metallurgy (UBM) reliability is one of the critical issues in the total reliability of a flip-chip bumping technology. Since the UBM materials and structures vary for different bumping technologies, the UBM strength and reliability need to be determined for each design and process. In add...
Gespeichert in:
| Veröffentlicht in: | IEEE transactions on components and packaging technologies 2001-12, Vol.24 (4), p.655-660 |
|---|---|
| Hauptverfasser: | , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 660 |
|---|---|
| container_issue | 4 |
| container_start_page | 655 |
| container_title | IEEE transactions on components and packaging technologies |
| container_volume | 24 |
| creator | Guo, W. Kuo, S.M. Zhang, C. |
| description | Under bump metallurgy (UBM) reliability is one of the critical issues in the total reliability of a flip-chip bumping technology. Since the UBM materials and structures vary for different bumping technologies, the UBM strength and reliability need to be determined for each design and process. In addition, the stress that a UBM experiences during thermal cycles depends on the solder alloy used in the interconnect. Different solder alloys require different UBM structures and strengths to achieve good reliability in thermal cycling. In this study, a simplified stress model is developed to determine the UBM stress during thermal cycling. A simplified stress model for the UBM strength is also developed. These models are used to predict the stress and strength of the UBM under the die pull test and the thermal cycle conditions for both eutectic and high lead solder systems. A methodology for using the pull test results to evaluate UBM reliability is also discussed. This methodology can be extended to the studies of UBM's with other solder systems such as lead free solder systems. |
| doi_str_mv | 10.1109/6144.974957 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_proquest_journals_884663395</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>974957</ieee_id><sourcerecordid>914649435</sourcerecordid><originalsourceid>FETCH-LOGICAL-c402t-89ea49e75bac7bed6f978d0ce81c377f13ed8669c309bfa90176d587aeb286ce3</originalsourceid><addsrcrecordid>eNqN0T1LxEAQBuBFFDxPKzurYKGF5NzNfk4ph6fCgSBah00ykT02yZlNlPx7E04sLNRqBuZhGOYl5JTRBWMUrhUTYgFagNR7ZMak1DGATvanPmEx55wdkqMQNpQyYQTMyOoJvbOZ864bIny3vreda-oQNWXU1wW2UdZX26jCznrft69D5Oqo-2ii0PhpGobQYRWOyUFpfcCTrzonL6vb5-V9vH68e1jerONc0KSLDaAVgFpmNtcZFqoEbQqao2E517pkHAujFOScQlZaoEyrQhptMUuMypHPyeVu77Zt3noMXVq5kKP3tsamDykwoQQILkd58atMQHIQEv6GRivJpPkHlJzq8cdzcv4Dbpq-rce_pMYIpTiH6b6rHcrbJoQWy3Tbusq2Q8poOoWZTmGmuzBHfbbTDhG_5dfwE84GmVU</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>884663395</pqid></control><display><type>article</type><title>Reliability evaluations of under bump metallurgy in two solder systems</title><source>IEEE Electronic Library (IEL)</source><creator>Guo, W. ; Kuo, S.M. ; Zhang, C.</creator><creatorcontrib>Guo, W. ; Kuo, S.M. ; Zhang, C.</creatorcontrib><description>Under bump metallurgy (UBM) reliability is one of the critical issues in the total reliability of a flip-chip bumping technology. Since the UBM materials and structures vary for different bumping technologies, the UBM strength and reliability need to be determined for each design and process. In addition, the stress that a UBM experiences during thermal cycles depends on the solder alloy used in the interconnect. Different solder alloys require different UBM structures and strengths to achieve good reliability in thermal cycling. In this study, a simplified stress model is developed to determine the UBM stress during thermal cycling. A simplified stress model for the UBM strength is also developed. These models are used to predict the stress and strength of the UBM under the die pull test and the thermal cycle conditions for both eutectic and high lead solder systems. A methodology for using the pull test results to evaluate UBM reliability is also discussed. This methodology can be extended to the studies of UBM's with other solder systems such as lead free solder systems.</description><identifier>ISSN: 1521-3331</identifier><identifier>EISSN: 1557-9972</identifier><identifier>DOI: 10.1109/6144.974957</identifier><identifier>CODEN: ITCPFB</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Alloying additive ; Design engineering ; Environmentally friendly manufacturing techniques ; Lead ; Materials reliability ; Mathematical models ; Metallurgy ; Methodology ; Packaging ; Predictive models ; Process design ; Soldering ; Solders ; Strength ; Stresses ; System testing ; Tensile stress ; Thermal cycling ; Thermal stresses</subject><ispartof>IEEE transactions on components and packaging technologies, 2001-12, Vol.24 (4), p.655-660</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2001</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c402t-89ea49e75bac7bed6f978d0ce81c377f13ed8669c309bfa90176d587aeb286ce3</citedby><cites>FETCH-LOGICAL-c402t-89ea49e75bac7bed6f978d0ce81c377f13ed8669c309bfa90176d587aeb286ce3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/974957$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27903,27904,54736</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/974957$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Guo, W.</creatorcontrib><creatorcontrib>Kuo, S.M.</creatorcontrib><creatorcontrib>Zhang, C.</creatorcontrib><title>Reliability evaluations of under bump metallurgy in two solder systems</title><title>IEEE transactions on components and packaging technologies</title><addtitle>TCAPT</addtitle><description>Under bump metallurgy (UBM) reliability is one of the critical issues in the total reliability of a flip-chip bumping technology. Since the UBM materials and structures vary for different bumping technologies, the UBM strength and reliability need to be determined for each design and process. In addition, the stress that a UBM experiences during thermal cycles depends on the solder alloy used in the interconnect. Different solder alloys require different UBM structures and strengths to achieve good reliability in thermal cycling. In this study, a simplified stress model is developed to determine the UBM stress during thermal cycling. A simplified stress model for the UBM strength is also developed. These models are used to predict the stress and strength of the UBM under the die pull test and the thermal cycle conditions for both eutectic and high lead solder systems. A methodology for using the pull test results to evaluate UBM reliability is also discussed. This methodology can be extended to the studies of UBM's with other solder systems such as lead free solder systems.</description><subject>Alloying additive</subject><subject>Design engineering</subject><subject>Environmentally friendly manufacturing techniques</subject><subject>Lead</subject><subject>Materials reliability</subject><subject>Mathematical models</subject><subject>Metallurgy</subject><subject>Methodology</subject><subject>Packaging</subject><subject>Predictive models</subject><subject>Process design</subject><subject>Soldering</subject><subject>Solders</subject><subject>Strength</subject><subject>Stresses</subject><subject>System testing</subject><subject>Tensile stress</subject><subject>Thermal cycling</subject><subject>Thermal stresses</subject><issn>1521-3331</issn><issn>1557-9972</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2001</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNqN0T1LxEAQBuBFFDxPKzurYKGF5NzNfk4ph6fCgSBah00ykT02yZlNlPx7E04sLNRqBuZhGOYl5JTRBWMUrhUTYgFagNR7ZMak1DGATvanPmEx55wdkqMQNpQyYQTMyOoJvbOZ864bIny3vreda-oQNWXU1wW2UdZX26jCznrft69D5Oqo-2ii0PhpGobQYRWOyUFpfcCTrzonL6vb5-V9vH68e1jerONc0KSLDaAVgFpmNtcZFqoEbQqao2E517pkHAujFOScQlZaoEyrQhptMUuMypHPyeVu77Zt3noMXVq5kKP3tsamDykwoQQILkd58atMQHIQEv6GRivJpPkHlJzq8cdzcv4Dbpq-rce_pMYIpTiH6b6rHcrbJoQWy3Tbusq2Q8poOoWZTmGmuzBHfbbTDhG_5dfwE84GmVU</recordid><startdate>20011201</startdate><enddate>20011201</enddate><creator>Guo, W.</creator><creator>Kuo, S.M.</creator><creator>Zhang, C.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>8BQ</scope><scope>JG9</scope><scope>7TB</scope><scope>FR3</scope><scope>F28</scope></search><sort><creationdate>20011201</creationdate><title>Reliability evaluations of under bump metallurgy in two solder systems</title><author>Guo, W. ; Kuo, S.M. ; Zhang, C.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c402t-89ea49e75bac7bed6f978d0ce81c377f13ed8669c309bfa90176d587aeb286ce3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2001</creationdate><topic>Alloying additive</topic><topic>Design engineering</topic><topic>Environmentally friendly manufacturing techniques</topic><topic>Lead</topic><topic>Materials reliability</topic><topic>Mathematical models</topic><topic>Metallurgy</topic><topic>Methodology</topic><topic>Packaging</topic><topic>Predictive models</topic><topic>Process design</topic><topic>Soldering</topic><topic>Solders</topic><topic>Strength</topic><topic>Stresses</topic><topic>System testing</topic><topic>Tensile stress</topic><topic>Thermal cycling</topic><topic>Thermal stresses</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Guo, W.</creatorcontrib><creatorcontrib>Kuo, S.M.</creatorcontrib><creatorcontrib>Zhang, C.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>METADEX</collection><collection>Materials Research Database</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Engineering Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><jtitle>IEEE transactions on components and packaging technologies</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Guo, W.</au><au>Kuo, S.M.</au><au>Zhang, C.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Reliability evaluations of under bump metallurgy in two solder systems</atitle><jtitle>IEEE transactions on components and packaging technologies</jtitle><stitle>TCAPT</stitle><date>2001-12-01</date><risdate>2001</risdate><volume>24</volume><issue>4</issue><spage>655</spage><epage>660</epage><pages>655-660</pages><issn>1521-3331</issn><eissn>1557-9972</eissn><coden>ITCPFB</coden><abstract>Under bump metallurgy (UBM) reliability is one of the critical issues in the total reliability of a flip-chip bumping technology. Since the UBM materials and structures vary for different bumping technologies, the UBM strength and reliability need to be determined for each design and process. In addition, the stress that a UBM experiences during thermal cycles depends on the solder alloy used in the interconnect. Different solder alloys require different UBM structures and strengths to achieve good reliability in thermal cycling. In this study, a simplified stress model is developed to determine the UBM stress during thermal cycling. A simplified stress model for the UBM strength is also developed. These models are used to predict the stress and strength of the UBM under the die pull test and the thermal cycle conditions for both eutectic and high lead solder systems. A methodology for using the pull test results to evaluate UBM reliability is also discussed. This methodology can be extended to the studies of UBM's with other solder systems such as lead free solder systems.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/6144.974957</doi><tpages>6</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 1521-3331 |
| ispartof | IEEE transactions on components and packaging technologies, 2001-12, Vol.24 (4), p.655-660 |
| issn | 1521-3331 1557-9972 |
| language | eng |
| recordid | cdi_proquest_journals_884663395 |
| source | IEEE Electronic Library (IEL) |
| subjects | Alloying additive Design engineering Environmentally friendly manufacturing techniques Lead Materials reliability Mathematical models Metallurgy Methodology Packaging Predictive models Process design Soldering Solders Strength Stresses System testing Tensile stress Thermal cycling Thermal stresses |
| title | Reliability evaluations of under bump metallurgy in two solder systems |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T08%3A10%3A16IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Reliability%20evaluations%20of%20under%20bump%20metallurgy%20in%20two%20solder%20systems&rft.jtitle=IEEE%20transactions%20on%20components%20and%20packaging%20technologies&rft.au=Guo,%20W.&rft.date=2001-12-01&rft.volume=24&rft.issue=4&rft.spage=655&rft.epage=660&rft.pages=655-660&rft.issn=1521-3331&rft.eissn=1557-9972&rft.coden=ITCPFB&rft_id=info:doi/10.1109/6144.974957&rft_dat=%3Cproquest_RIE%3E914649435%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=884663395&rft_id=info:pmid/&rft_ieee_id=974957&rfr_iscdi=true |