Optimized desoak system for IC panel test handlers

This paper presents a unique airflow-based thermal system that returns thermally conditioned integrated circuit (IC) devices to a near ambient temperature level. This "desoak" thermal system addresses specific requirements of new IC panel (lead frame and strip) test handlers, which have ve...

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Veröffentlicht in:	IEEE transactions on electronics packaging manufacturing 2002-04, Vol.25 (2), p.120-126
Hauptverfasser:	Pfahnl, A.C., Dunn, J., Muller, L.A.
Format:	Artikel
Sprache:	eng
Schlagworte:	Ambient temperature Applied sciences Boundary conditions Circuit testing Cooling Cooling loads Cooling systems Design engineering Design. Technologies. Operation analysis. Testing Devices Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Hardware Integrated circuit testing Integrated circuits Panels Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Strips System testing Temperature control Temperature distribution Testing, measurement, noise and reliability Thermal resistance
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