The package integration of RF-MEMS switch and control IC for wireless applications
The integration of microelectromechanical systems (MEMS) switch and control integrated circuit (IC) in a single package was developed for use in next-generation portable wireless systems. This packaged radio-frequency (RF) MEMS switch exhibits an insertion loss under -0.4 dB, and isolation greater t...
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| Veröffentlicht in: | IEEE transactions on advanced packaging 2003-08, Vol.26 (3), p.255-260 |
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| container_title | IEEE transactions on advanced packaging |
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| creator | De Silva, A.P. Hughes, H.G. |
| description | The integration of microelectromechanical systems (MEMS) switch and control integrated circuit (IC) in a single package was developed for use in next-generation portable wireless systems. This packaged radio-frequency (RF) MEMS switch exhibits an insertion loss under -0.4 dB, and isolation greater than -45 dB. This MEMS switch technology has significantly better RF characteristics than conventional PIN diodes or field effect transistor (FET) switches and consumes less power. The RF MEMS switch chip has been integrated with a high voltage charge pump plus control logic chips into a single package to accommodate the low voltage requirements in portable wireless applications. This paper discusses the package assembly process and critical parameters for integration of MEMS devices and bi-complementary metal oxide semiconductor (CMOS) control integrated circuit (IC) into a single package. |
| doi_str_mv | 10.1109/TADVP.2003.818056 |
| format | Article |
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This packaged radio-frequency (RF) MEMS switch exhibits an insertion loss under -0.4 dB, and isolation greater than -45 dB. This MEMS switch technology has significantly better RF characteristics than conventional PIN diodes or field effect transistor (FET) switches and consumes less power. The RF MEMS switch chip has been integrated with a high voltage charge pump plus control logic chips into a single package to accommodate the low voltage requirements in portable wireless applications. This paper discusses the package assembly process and critical parameters for integration of MEMS devices and bi-complementary metal oxide semiconductor (CMOS) control integrated circuit (IC) into a single package.</description><identifier>ISSN: 1521-3323</identifier><identifier>EISSN: 1557-9980</identifier><identifier>DOI: 10.1109/TADVP.2003.818056</identifier><identifier>CODEN: ITAPFZ</identifier><language>eng</language><publisher>Piscataway, NY: IEEE</publisher><subject>Application specific integrated circuits ; Applied sciences ; Circuit properties ; CMOS integrated circuits ; Design. Technologies. Operation analysis. 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This packaged radio-frequency (RF) MEMS switch exhibits an insertion loss under -0.4 dB, and isolation greater than -45 dB. This MEMS switch technology has significantly better RF characteristics than conventional PIN diodes or field effect transistor (FET) switches and consumes less power. The RF MEMS switch chip has been integrated with a high voltage charge pump plus control logic chips into a single package to accommodate the low voltage requirements in portable wireless applications. This paper discusses the package assembly process and critical parameters for integration of MEMS devices and bi-complementary metal oxide semiconductor (CMOS) control integrated circuit (IC) into a single package.</description><subject>Application specific integrated circuits</subject><subject>Applied sciences</subject><subject>Circuit properties</subject><subject>CMOS integrated circuits</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Diodes</subject><subject>Electric, optical and optoelectronic circuits</subject><subject>Electronic circuits</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>FETs</subject><subject>Integrated circuit packaging</subject><subject>Integrated circuits</subject><subject>Micro- and nanoelectromechanical devices (mems/nems)</subject><subject>Microelectromechanical systems</subject><subject>Microswitches</subject><subject>Radio frequency</subject><subject>Radiofrequency microelectromechanical systems</subject><subject>Semiconductor device packaging</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Switches</subject><subject>Switching, multiplexing, switched capacity circuits</subject><issn>1521-3323</issn><issn>1557-9980</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2003</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNqNkVtLxDAQhYsoeP0B4ksQ9K1r7kkfZb2Coujqa0jTiUZrU5Mu4r-36wqCTw4MMzDfOTCcotgleEIIro5mxyePtxOKMZtoorGQK8UGEUKVVaXx6mKnpGSMsvViM-cXjAnXnG4Ud7NnQL11r_YJUOgGeEp2CLFD0aO7s_L69Poe5Y8wuGdkuwa52A0ptuhyinxM6CMkaCFnZPu-De5bmbeLNW_bDDs_c6t4ODudTS_Kq5vzy-nxVek4YUPplXegGiWJ1ZpD45iXVsi68rKWgJkXolG8poSDAGDcNtw6p2tcO2a1U2yrOFz69im-zyEP5i1kB21rO4jzbGilCFOM_QPECjPyD1DLsbQYwf0_4Eucp2781oy_UC7HHiGyhFyKOSfwpk_hzaZPQ7BZhGa-QzOL0MwytFFz8GNss7OtT7ZzIf8KBdFUUjxye0suAMDvmTIpqGBfP9CfVQ</recordid><startdate>20030801</startdate><enddate>20030801</enddate><creator>De Silva, A.P.</creator><creator>Hughes, H.G.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>RIA</scope><scope>RIE</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>7U5</scope><scope>7TB</scope><scope>FR3</scope></search><sort><creationdate>20030801</creationdate><title>The package integration of RF-MEMS switch and control IC for wireless applications</title><author>De Silva, A.P. ; Hughes, H.G.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c413t-f7fce7d761a884edc3f6a56b9f6b6e03f55d74b214e5ee34ad4acc8b0bc3a8c73</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2003</creationdate><topic>Application specific integrated circuits</topic><topic>Applied sciences</topic><topic>Circuit properties</topic><topic>CMOS integrated circuits</topic><topic>Design. Technologies. Operation analysis. Testing</topic><topic>Diodes</topic><topic>Electric, optical and optoelectronic circuits</topic><topic>Electronic circuits</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>FETs</topic><topic>Integrated circuit packaging</topic><topic>Integrated circuits</topic><topic>Micro- and nanoelectromechanical devices (mems/nems)</topic><topic>Microelectromechanical systems</topic><topic>Microswitches</topic><topic>Radio frequency</topic><topic>Radiofrequency microelectromechanical systems</topic><topic>Semiconductor device packaging</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Switches</topic><topic>Switching, multiplexing, switched capacity circuits</topic><toplevel>online_resources</toplevel><creatorcontrib>De Silva, A.P.</creatorcontrib><creatorcontrib>Hughes, H.G.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Engineering Research Database</collection><jtitle>IEEE transactions on advanced packaging</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>De Silva, A.P.</au><au>Hughes, H.G.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>The package integration of RF-MEMS switch and control IC for wireless applications</atitle><jtitle>IEEE transactions on advanced packaging</jtitle><stitle>TADVP</stitle><date>2003-08-01</date><risdate>2003</risdate><volume>26</volume><issue>3</issue><spage>255</spage><epage>260</epage><pages>255-260</pages><issn>1521-3323</issn><eissn>1557-9980</eissn><coden>ITAPFZ</coden><abstract>The integration of microelectromechanical systems (MEMS) switch and control integrated circuit (IC) in a single package was developed for use in next-generation portable wireless systems. This packaged radio-frequency (RF) MEMS switch exhibits an insertion loss under -0.4 dB, and isolation greater than -45 dB. This MEMS switch technology has significantly better RF characteristics than conventional PIN diodes or field effect transistor (FET) switches and consumes less power. The RF MEMS switch chip has been integrated with a high voltage charge pump plus control logic chips into a single package to accommodate the low voltage requirements in portable wireless applications. This paper discusses the package assembly process and critical parameters for integration of MEMS devices and bi-complementary metal oxide semiconductor (CMOS) control integrated circuit (IC) into a single package.</abstract><cop>Piscataway, NY</cop><pub>IEEE</pub><doi>10.1109/TADVP.2003.818056</doi><tpages>6</tpages></addata></record> |
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| identifier | ISSN: 1521-3323 |
| ispartof | IEEE transactions on advanced packaging, 2003-08, Vol.26 (3), p.255-260 |
| issn | 1521-3323 1557-9980 |
| language | eng |
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| source | IEEE Electronic Library (IEL) |
| subjects | Application specific integrated circuits Applied sciences Circuit properties CMOS integrated circuits Design. Technologies. Operation analysis. Testing Diodes Electric, optical and optoelectronic circuits Electronic circuits Electronics Exact sciences and technology FETs Integrated circuit packaging Integrated circuits Micro- and nanoelectromechanical devices (mems/nems) Microelectromechanical systems Microswitches Radio frequency Radiofrequency microelectromechanical systems Semiconductor device packaging Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Switches Switching, multiplexing, switched capacity circuits |
| title | The package integration of RF-MEMS switch and control IC for wireless applications |
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