Effect of surface asperity truncation on thermal contact conductance
This paper presents studies on thermal contact conductance at light contact loads. Surface profilometry measurements are presented which show that actual surface asperity height distributions are not perfectly Gaussian. The highest asperities are truncated, causing existing thermal contact conductan...
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Veröffentlicht in: | IEEE transactions on components and packaging technologies 2003-03, Vol.26 (1), p.48-54 |
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description | This paper presents studies on thermal contact conductance at light contact loads. Surface profilometry measurements are presented which show that actual surface asperity height distributions are not perfectly Gaussian. The highest asperities are truncated, causing existing thermal contact conductance models to underpredict experimental data. These observations have been incorporated into modifications of existing contact conductance models. The truncation leads to an enhancement of thermal contact conductance at light contact pressures. The preliminary model has been compared against thermal contact conductance data presented in the open literature, and good agreement is observed. The results show that the truncation is a function of the roughness level: the rougher the surface, the more truncated the surface height distribution. |
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Surface profilometry measurements are presented which show that actual surface asperity height distributions are not perfectly Gaussian. The highest asperities are truncated, causing existing thermal contact conductance models to underpredict experimental data. These observations have been incorporated into modifications of existing contact conductance models. The truncation leads to an enhancement of thermal contact conductance at light contact pressures. The preliminary model has been compared against thermal contact conductance data presented in the open literature, and good agreement is observed. The results show that the truncation is a function of the roughness level: the rougher the surface, the more truncated the surface height distribution.</description><identifier>ISSN: 1521-3331</identifier><identifier>EISSN: 1557-9972</identifier><identifier>DOI: 10.1109/TCAPT.2003.811469</identifier><identifier>CODEN: ITCPFB</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Asperity ; Conductance ; Contact ; Contact loads ; Gaussian ; Heat engines ; Heat transfer ; Microelectronics ; Nickel ; Niobium ; Nuclear fuels ; Packaging ; Rough surfaces ; Solids ; Surface roughness ; Thermal conductivity</subject><ispartof>IEEE transactions on components and packaging technologies, 2003-03, Vol.26 (1), p.48-54</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2003</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c384t-e90c6f6eb2c3d4a52fda18066bc13aae5ff6e15b928fe952587da91e016a154b3</citedby><cites>FETCH-LOGICAL-c384t-e90c6f6eb2c3d4a52fda18066bc13aae5ff6e15b928fe952587da91e016a154b3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1202902$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>315,781,785,797,27926,27927,54760</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1202902$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Milanez, F.H.</creatorcontrib><creatorcontrib>Yovanovich, M.M.</creatorcontrib><creatorcontrib>Culham, J.R.</creatorcontrib><title>Effect of surface asperity truncation on thermal contact conductance</title><title>IEEE transactions on components and packaging technologies</title><addtitle>TCAPT</addtitle><description>This paper presents studies on thermal contact conductance at light contact loads. Surface profilometry measurements are presented which show that actual surface asperity height distributions are not perfectly Gaussian. The highest asperities are truncated, causing existing thermal contact conductance models to underpredict experimental data. These observations have been incorporated into modifications of existing contact conductance models. The truncation leads to an enhancement of thermal contact conductance at light contact pressures. The preliminary model has been compared against thermal contact conductance data presented in the open literature, and good agreement is observed. The results show that the truncation is a function of the roughness level: the rougher the surface, the more truncated the surface height distribution.</description><subject>Asperity</subject><subject>Conductance</subject><subject>Contact</subject><subject>Contact loads</subject><subject>Gaussian</subject><subject>Heat engines</subject><subject>Heat transfer</subject><subject>Microelectronics</subject><subject>Nickel</subject><subject>Niobium</subject><subject>Nuclear fuels</subject><subject>Packaging</subject><subject>Rough surfaces</subject><subject>Solids</subject><subject>Surface roughness</subject><subject>Thermal conductivity</subject><issn>1521-3331</issn><issn>1557-9972</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2003</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNqFkU1LAzEQhhdRsFZ_gHhZPOhpayZfTY6l1g8o6KGeQ5qd4Jbtbk2yh_57d60geFAYeAfmeWcY3iy7BDIBIPpuNZ-9riaUEDZRAFzqo2wEQkwLraf0eOgpFIwxOM3OYtwQAlxxPcruF96jS3nr89gFbx3mNu4wVGmfp9A1zqaqbfK-0juGra1z1zbJ9o5ey84l2zg8z068rSNefOs4e3tYrOZPxfLl8Xk-WxaOKZ4K1MRJL3FNHSu5FdSXFhSRcu2AWYvC90MQa02VRy2oUNPSakAC0oLgazbObg97d6H96DAms62iw7q2DbZdNJrAlGihVE_e_ElSTYXkWvwPKqq0orIHr3-Bm7YLTf-uUYpTTpUczsIBcqGNMaA3u1BtbdgbIGbIyXzlZIaczCGn3nN18FSI-MNTQjWh7BPWXo5U</recordid><startdate>20030301</startdate><enddate>20030301</enddate><creator>Milanez, F.H.</creator><creator>Yovanovich, M.M.</creator><creator>Culham, J.R.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>7TB</scope><scope>FR3</scope><scope>F28</scope></search><sort><creationdate>20030301</creationdate><title>Effect of surface asperity truncation on thermal contact conductance</title><author>Milanez, F.H. ; Yovanovich, M.M. ; Culham, J.R.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c384t-e90c6f6eb2c3d4a52fda18066bc13aae5ff6e15b928fe952587da91e016a154b3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2003</creationdate><topic>Asperity</topic><topic>Conductance</topic><topic>Contact</topic><topic>Contact loads</topic><topic>Gaussian</topic><topic>Heat engines</topic><topic>Heat transfer</topic><topic>Microelectronics</topic><topic>Nickel</topic><topic>Niobium</topic><topic>Nuclear fuels</topic><topic>Packaging</topic><topic>Rough surfaces</topic><topic>Solids</topic><topic>Surface roughness</topic><topic>Thermal conductivity</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Milanez, F.H.</creatorcontrib><creatorcontrib>Yovanovich, M.M.</creatorcontrib><creatorcontrib>Culham, J.R.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Engineering Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><jtitle>IEEE transactions on components and packaging technologies</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Milanez, F.H.</au><au>Yovanovich, M.M.</au><au>Culham, J.R.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effect of surface asperity truncation on thermal contact conductance</atitle><jtitle>IEEE transactions on components and packaging technologies</jtitle><stitle>TCAPT</stitle><date>2003-03-01</date><risdate>2003</risdate><volume>26</volume><issue>1</issue><spage>48</spage><epage>54</epage><pages>48-54</pages><issn>1521-3331</issn><eissn>1557-9972</eissn><coden>ITCPFB</coden><abstract>This paper presents studies on thermal contact conductance at light contact loads. Surface profilometry measurements are presented which show that actual surface asperity height distributions are not perfectly Gaussian. The highest asperities are truncated, causing existing thermal contact conductance models to underpredict experimental data. These observations have been incorporated into modifications of existing contact conductance models. The truncation leads to an enhancement of thermal contact conductance at light contact pressures. The preliminary model has been compared against thermal contact conductance data presented in the open literature, and good agreement is observed. The results show that the truncation is a function of the roughness level: the rougher the surface, the more truncated the surface height distribution.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/TCAPT.2003.811469</doi><tpages>7</tpages></addata></record> |
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subjects | Asperity Conductance Contact Contact loads Gaussian Heat engines Heat transfer Microelectronics Nickel Niobium Nuclear fuels Packaging Rough surfaces Solids Surface roughness Thermal conductivity |
title | Effect of surface asperity truncation on thermal contact conductance |
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