Four decades of research on thermal contact, gap, and joint resistance in microelectronics

The Keynote Paper reviews and highlights over 40 years of research on solutions for steady-state and transient thermal constriction and spreading resistances, and thermomechanical models for contact, gap and joint resistances of joints formed by conforming rough surfaces, nonconforming smooth surfac...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	IEEE transactions on components and packaging technologies 2005-06, Vol.28 (2), p.182-206
1. Verfasser:	Yovanovich, M.M.
Format:	Artikel
Sprache:	eng
Schlagworte:	Contact Contact resistance Correlation Elastoplasticity Equations Greases Mathematical models Microelectronics Microgap and macrogap thermal resistance Microhardness Paraffins Rough surfaces Steady-state Surface resistance Surface roughness Thermal conductivity Thermal resistance Thermomechanical processes transient thermal constriction Vickers indenters
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!