Four decades of research on thermal contact, gap, and joint resistance in microelectronics
The Keynote Paper reviews and highlights over 40 years of research on solutions for steady-state and transient thermal constriction and spreading resistances, and thermomechanical models for contact, gap and joint resistances of joints formed by conforming rough surfaces, nonconforming smooth surfac...
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| Veröffentlicht in: | IEEE transactions on components and packaging technologies 2005-06, Vol.28 (2), p.182-206 |
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| container_title | IEEE transactions on components and packaging technologies |
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| creator | Yovanovich, M.M. |
| description | The Keynote Paper reviews and highlights over 40 years of research on solutions for steady-state and transient thermal constriction and spreading resistances, and thermomechanical models for contact, gap and joint resistances of joints formed by conforming rough surfaces, nonconforming smooth surfaces, and nonconforming rough surfaces. Microgap and macrogap thermal resistance and conductance models are reviewed, and important relations and correlation equations are presented. Contact microhardness, determined by Vickers indenters, are correlated and incorporated into the contact model for conforming rough surfaces. Microhardness parameters are correlated with Brinell hardness values. Elastoplastic contact models for joints formed by smooth sphere-smooth flat and conforming rough surfaces are presented. A simple thermomechanical model for microgaps occupied by oil, grease, grease filled with solid particles, and phase change materials such as paraffins is reviewed, and good agreement with recently published data is noted. |
| doi_str_mv | 10.1109/TCAPT.2005.848483 |
| format | Article |
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Microgap and macrogap thermal resistance and conductance models are reviewed, and important relations and correlation equations are presented. Contact microhardness, determined by Vickers indenters, are correlated and incorporated into the contact model for conforming rough surfaces. Microhardness parameters are correlated with Brinell hardness values. Elastoplastic contact models for joints formed by smooth sphere-smooth flat and conforming rough surfaces are presented. 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Microgap and macrogap thermal resistance and conductance models are reviewed, and important relations and correlation equations are presented. Contact microhardness, determined by Vickers indenters, are correlated and incorporated into the contact model for conforming rough surfaces. Microhardness parameters are correlated with Brinell hardness values. Elastoplastic contact models for joints formed by smooth sphere-smooth flat and conforming rough surfaces are presented. A simple thermomechanical model for microgaps occupied by oil, grease, grease filled with solid particles, and phase change materials such as paraffins is reviewed, and good agreement with recently published data is noted.</description><subject>Contact</subject><subject>Contact resistance</subject><subject>Correlation</subject><subject>Elastoplasticity</subject><subject>Equations</subject><subject>Greases</subject><subject>Mathematical models</subject><subject>Microelectronics</subject><subject>Microgap and macrogap thermal resistance</subject><subject>Microhardness</subject><subject>Paraffins</subject><subject>Rough surfaces</subject><subject>Steady-state</subject><subject>Surface resistance</subject><subject>Surface roughness</subject><subject>Thermal conductivity</subject><subject>Thermal resistance</subject><subject>Thermomechanical processes</subject><subject>transient thermal constriction</subject><subject>Vickers indenters</subject><issn>1521-3331</issn><issn>1557-9972</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2005</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNp90U1LAzEQBuBFFKzVHyBeggfx0K352M1mjqVYFQqK9OQlpNmp3bJNarI9-O_NWkHwIDlMDs8MzLxZdsnomDEKd4vp5GUx5pSWY1WkJ46yASvLKgeo-HH_5ywXQrDT7CzGDaUsKRhkbzO_D6RGa2qMxK9IwIgm2DXxjnRrDFvTEutdZ2w3Iu9mNyLG1WTjG9f1tomdcRZJ48i2scFji7YL3jU2nmcnK9NGvPipw-x1dr-YPubz54en6WSe24LzLi-ZWSrFixIQ7VKAKlUhS8Sl5WAYIIBVpkQhhVgVUINkSlLDTFHXKMQwuzkM3QX_scfY6W0TLbatcej3UXNFuShkleDtv5DJivFKgoREr__QTTqSSztoJYECAJMJsQNKS8cYcKV3odma8KkZ1X0k-jsS3UeiD5GknqtDT4OIv74QHHglvgBU94dO</recordid><startdate>20050601</startdate><enddate>20050601</enddate><creator>Yovanovich, M.M.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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Microgap and macrogap thermal resistance and conductance models are reviewed, and important relations and correlation equations are presented. Contact microhardness, determined by Vickers indenters, are correlated and incorporated into the contact model for conforming rough surfaces. Microhardness parameters are correlated with Brinell hardness values. Elastoplastic contact models for joints formed by smooth sphere-smooth flat and conforming rough surfaces are presented. A simple thermomechanical model for microgaps occupied by oil, grease, grease filled with solid particles, and phase change materials such as paraffins is reviewed, and good agreement with recently published data is noted.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/TCAPT.2005.848483</doi><tpages>25</tpages></addata></record> |
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| ispartof | IEEE transactions on components and packaging technologies, 2005-06, Vol.28 (2), p.182-206 |
| issn | 1521-3331 1557-9972 |
| language | eng |
| recordid | cdi_proquest_journals_869099916 |
| source | IEEE Electronic Library (IEL) |
| subjects | Contact Contact resistance Correlation Elastoplasticity Equations Greases Mathematical models Microelectronics Microgap and macrogap thermal resistance Microhardness Paraffins Rough surfaces Steady-state Surface resistance Surface roughness Thermal conductivity Thermal resistance Thermomechanical processes transient thermal constriction Vickers indenters |
| title | Four decades of research on thermal contact, gap, and joint resistance in microelectronics |
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