Anisotropic Conductive Film Bonding by Making Use of a High-Power Diode Laser

Anisotropic conductive film (ACF) bonding between liquid crystal displays (LCDs) and driver integrated circuits (ICs) is one of the key technologies for developing high-resolution LCDs. The bonding pitch between LCD and tape carrier package (TCP), which influences the total reliability of LCD module...

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Veröffentlicht in:	IEEE transactions on advanced packaging 2006-11, Vol.29 (4), p.701-706
Hauptverfasser:	Ryu, Kwang Hyun, Kwon, Namic, Seo, Myung Hee, Lee, Myung Hoon, Nam, Gi Jung, Kwak, No Heung
Format:	Artikel
Sprache:	eng
Schlagworte:	Anisotropic conductive film (ACF) bonding Anisotropic conductive films Anisotropy Applied sciences Bonding Circuit properties Circuits of signal characteristics conditioning (including delay circuits) Curing Design. Technologies. Operation analysis. Testing Diode lasers Display Driver circuits Electric, optical and optoelectronic circuits Electronic circuits Electronics Exact sciences and technology film on glass bonding high-power diode laser Integrated circuit packaging Integrated circuit reliability Integrated circuit technology Integrated circuits laser bonding Lasers LCDs liquid crystal display (LCD) packaging Liquid crystal displays Other multijunction devices. Power transistors. Thyristors Packages Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices TCP (protocol) Temperature
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