Thermal Fatigue of SnPb and SAC Resistor Joints: Analysis of Stress-Strain as a Function of Cycle Parameters

Accelerated thermal cycling (ATC) has been widely used in the microelectronics industry for reliability assessment. The relative effects of thermal cycling parameters (temperature range, dwell time, and ramp rate) and the failure mechanisms they induce have been the subject of many studies; however,...

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Veröffentlicht in:	IEEE transactions on advanced packaging 2006-11, Vol.29 (4), p.690-700
Hauptverfasser:	Yan Qi, Ghorbani, H.R., Spelt, J.K.
Format:	Artikel
Sprache:	eng
Schlagworte:	Accelerated thermal cycling (ATC) Applied sciences Capacitive sensors Computer simulation Design engineering Design. Technologies. Operation analysis. Testing Electric shock Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Fatigue Finite element method finite-element analysis (FEA) Integrated circuits Iron lead-free solder Mathematical models Ramps resistor Resistors Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices solder Solders Strain stress and strain analysis Temperature distribution temperature gradient Testing Thermal cycling thermal fatigue Thermal resistance thermal shock Thermal stresses Vehicles
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