Thermal Interface Materials: Historical Perspective, Status, and Future Directions

With the continual increase in cooling demand for microprocessors, there has been an increased focus within the microelectronics industry on developing thermal solutions. Thermal interface materials (TIMs) play a key role in thermally connecting various components of the thermal solution. Review of...

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Veröffentlicht in:	Proceedings of the IEEE 2006-08, Vol.94 (8), p.1571-1586
1. Verfasser:	Prasher, R.
Format:	Artikel
Sprache:	eng
Schlagworte:	Bond line thickness (BLT) Contact resistance Cooling Immune system Joining Marketing Mathematical models Microelectronics Microprocessors Nanoparticles nanotube Nanotubes polymer rheology Polymers Rough surfaces Solids Surface resistance thermal boundary resistance Thermal conductivity Thermal factors thermal interface material (TIM) Thermal resistance Thermal stresses
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