Thermal Interface Materials: Historical Perspective, Status, and Future Directions
With the continual increase in cooling demand for microprocessors, there has been an increased focus within the microelectronics industry on developing thermal solutions. Thermal interface materials (TIMs) play a key role in thermally connecting various components of the thermal solution. Review of...
Gespeichert in:
| Veröffentlicht in: | Proceedings of the IEEE 2006-08, Vol.94 (8), p.1571-1586 |
|---|---|
| 1. Verfasser: | |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 1586 |
|---|---|
| container_issue | 8 |
| container_start_page | 1571 |
| container_title | Proceedings of the IEEE |
| container_volume | 94 |
| creator | Prasher, R. |
| description | With the continual increase in cooling demand for microprocessors, there has been an increased focus within the microelectronics industry on developing thermal solutions. Thermal interface materials (TIMs) play a key role in thermally connecting various components of the thermal solution. Review of the progress made in the area of TIMs in the past five years is presented. The focus is on the rheology-based modeling and design of polymeric TIMs due to their widespread use. Review of limited literature on the thermal performance of solders is also provided. Merits and demerits of using nanoparticles and nanotubes for TIM applications are also discussed. I conclude the paper with some directions for the future that I feel are relatively untouched and potentially very beneficial |
| doi_str_mv | 10.1109/JPROC.2006.879796 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_proquest_journals_865844630</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1705143</ieee_id><sourcerecordid>2343842651</sourcerecordid><originalsourceid>FETCH-LOGICAL-c471t-eadcb68996fdc1ec2a57e63de6ba7e74a9a9b61996d8b06876f67636d46da603</originalsourceid><addsrcrecordid>eNp9kU9Lw0AQxRdRsFY_gHgJXvTQ1N1NMrvrTarVSqWl9h42mwmmtEndTQS_vRsjCB48zcD7vfnDI-Sc0TFjVN08L1eLyZhTCmMplFBwQAYsSWTIeQKHZEApk6HiTB2TE-c2lNIogWhAVus3tDu9DWZVg7bQBoMX7btSb91t8FS6pral8foSrdujacoPHAWvjW5aNwp0lQfTtmktBvel7dS6cqfkqPBuPPupQ7KePqwnT-F88Tib3M1DEwvWhKhzk4FUCorcMDRcJwIhyhEyLVDEWmmVAfN6LjMKUkABAiLIY8g10GhIrvqxe1u_t-iadFc6g9utrrBuXSoVMJBUCU9e_0syyrn0h3Du0cs_6KZubeXfSCUkMo4h6jazHjK2ds5ike5tudP2009KuzTS7zTSLo20T8N7LnpPiYi_vKAJi6PoC8XVhcs</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>865844630</pqid></control><display><type>article</type><title>Thermal Interface Materials: Historical Perspective, Status, and Future Directions</title><source>IEEE Electronic Library (IEL)</source><creator>Prasher, R.</creator><creatorcontrib>Prasher, R.</creatorcontrib><description>With the continual increase in cooling demand for microprocessors, there has been an increased focus within the microelectronics industry on developing thermal solutions. Thermal interface materials (TIMs) play a key role in thermally connecting various components of the thermal solution. Review of the progress made in the area of TIMs in the past five years is presented. The focus is on the rheology-based modeling and design of polymeric TIMs due to their widespread use. Review of limited literature on the thermal performance of solders is also provided. Merits and demerits of using nanoparticles and nanotubes for TIM applications are also discussed. I conclude the paper with some directions for the future that I feel are relatively untouched and potentially very beneficial</description><identifier>ISSN: 0018-9219</identifier><identifier>EISSN: 1558-2256</identifier><identifier>DOI: 10.1109/JPROC.2006.879796</identifier><identifier>CODEN: IEEPAD</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Bond line thickness (BLT) ; Contact resistance ; Cooling ; Immune system ; Joining ; Marketing ; Mathematical models ; Microelectronics ; Microprocessors ; Nanoparticles ; nanotube ; Nanotubes ; polymer rheology ; Polymers ; Rough surfaces ; Solids ; Surface resistance ; thermal boundary resistance ; Thermal conductivity ; Thermal factors ; thermal interface material (TIM) ; Thermal resistance ; Thermal stresses</subject><ispartof>Proceedings of the IEEE, 2006-08, Vol.94 (8), p.1571-1586</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2006</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c471t-eadcb68996fdc1ec2a57e63de6ba7e74a9a9b61996d8b06876f67636d46da603</citedby><cites>FETCH-LOGICAL-c471t-eadcb68996fdc1ec2a57e63de6ba7e74a9a9b61996d8b06876f67636d46da603</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1705143$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27901,27902,54733</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1705143$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Prasher, R.</creatorcontrib><title>Thermal Interface Materials: Historical Perspective, Status, and Future Directions</title><title>Proceedings of the IEEE</title><addtitle>JPROC</addtitle><description>With the continual increase in cooling demand for microprocessors, there has been an increased focus within the microelectronics industry on developing thermal solutions. Thermal interface materials (TIMs) play a key role in thermally connecting various components of the thermal solution. Review of the progress made in the area of TIMs in the past five years is presented. The focus is on the rheology-based modeling and design of polymeric TIMs due to their widespread use. Review of limited literature on the thermal performance of solders is also provided. Merits and demerits of using nanoparticles and nanotubes for TIM applications are also discussed. I conclude the paper with some directions for the future that I feel are relatively untouched and potentially very beneficial</description><subject>Bond line thickness (BLT)</subject><subject>Contact resistance</subject><subject>Cooling</subject><subject>Immune system</subject><subject>Joining</subject><subject>Marketing</subject><subject>Mathematical models</subject><subject>Microelectronics</subject><subject>Microprocessors</subject><subject>Nanoparticles</subject><subject>nanotube</subject><subject>Nanotubes</subject><subject>polymer rheology</subject><subject>Polymers</subject><subject>Rough surfaces</subject><subject>Solids</subject><subject>Surface resistance</subject><subject>thermal boundary resistance</subject><subject>Thermal conductivity</subject><subject>Thermal factors</subject><subject>thermal interface material (TIM)</subject><subject>Thermal resistance</subject><subject>Thermal stresses</subject><issn>0018-9219</issn><issn>1558-2256</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2006</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNp9kU9Lw0AQxRdRsFY_gHgJXvTQ1N1NMrvrTarVSqWl9h42mwmmtEndTQS_vRsjCB48zcD7vfnDI-Sc0TFjVN08L1eLyZhTCmMplFBwQAYsSWTIeQKHZEApk6HiTB2TE-c2lNIogWhAVus3tDu9DWZVg7bQBoMX7btSb91t8FS6pral8foSrdujacoPHAWvjW5aNwp0lQfTtmktBvel7dS6cqfkqPBuPPupQ7KePqwnT-F88Tib3M1DEwvWhKhzk4FUCorcMDRcJwIhyhEyLVDEWmmVAfN6LjMKUkABAiLIY8g10GhIrvqxe1u_t-iadFc6g9utrrBuXSoVMJBUCU9e_0syyrn0h3Du0cs_6KZubeXfSCUkMo4h6jazHjK2ds5ike5tudP2009KuzTS7zTSLo20T8N7LnpPiYi_vKAJi6PoC8XVhcs</recordid><startdate>20060801</startdate><enddate>20060801</enddate><creator>Prasher, R.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>F28</scope><scope>FR3</scope></search><sort><creationdate>20060801</creationdate><title>Thermal Interface Materials: Historical Perspective, Status, and Future Directions</title><author>Prasher, R.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c471t-eadcb68996fdc1ec2a57e63de6ba7e74a9a9b61996d8b06876f67636d46da603</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2006</creationdate><topic>Bond line thickness (BLT)</topic><topic>Contact resistance</topic><topic>Cooling</topic><topic>Immune system</topic><topic>Joining</topic><topic>Marketing</topic><topic>Mathematical models</topic><topic>Microelectronics</topic><topic>Microprocessors</topic><topic>Nanoparticles</topic><topic>nanotube</topic><topic>Nanotubes</topic><topic>polymer rheology</topic><topic>Polymers</topic><topic>Rough surfaces</topic><topic>Solids</topic><topic>Surface resistance</topic><topic>thermal boundary resistance</topic><topic>Thermal conductivity</topic><topic>Thermal factors</topic><topic>thermal interface material (TIM)</topic><topic>Thermal resistance</topic><topic>Thermal stresses</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Prasher, R.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><jtitle>Proceedings of the IEEE</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Prasher, R.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Thermal Interface Materials: Historical Perspective, Status, and Future Directions</atitle><jtitle>Proceedings of the IEEE</jtitle><stitle>JPROC</stitle><date>2006-08-01</date><risdate>2006</risdate><volume>94</volume><issue>8</issue><spage>1571</spage><epage>1586</epage><pages>1571-1586</pages><issn>0018-9219</issn><eissn>1558-2256</eissn><coden>IEEPAD</coden><abstract>With the continual increase in cooling demand for microprocessors, there has been an increased focus within the microelectronics industry on developing thermal solutions. Thermal interface materials (TIMs) play a key role in thermally connecting various components of the thermal solution. Review of the progress made in the area of TIMs in the past five years is presented. The focus is on the rheology-based modeling and design of polymeric TIMs due to their widespread use. Review of limited literature on the thermal performance of solders is also provided. Merits and demerits of using nanoparticles and nanotubes for TIM applications are also discussed. I conclude the paper with some directions for the future that I feel are relatively untouched and potentially very beneficial</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/JPROC.2006.879796</doi><tpages>16</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 0018-9219 |
| ispartof | Proceedings of the IEEE, 2006-08, Vol.94 (8), p.1571-1586 |
| issn | 0018-9219 1558-2256 |
| language | eng |
| recordid | cdi_proquest_journals_865844630 |
| source | IEEE Electronic Library (IEL) |
| subjects | Bond line thickness (BLT) Contact resistance Cooling Immune system Joining Marketing Mathematical models Microelectronics Microprocessors Nanoparticles nanotube Nanotubes polymer rheology Polymers Rough surfaces Solids Surface resistance thermal boundary resistance Thermal conductivity Thermal factors thermal interface material (TIM) Thermal resistance Thermal stresses |
| title | Thermal Interface Materials: Historical Perspective, Status, and Future Directions |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T02%3A28%3A16IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Thermal%20Interface%20Materials:%20Historical%20Perspective,%20Status,%20and%20Future%20Directions&rft.jtitle=Proceedings%20of%20the%20IEEE&rft.au=Prasher,%20R.&rft.date=2006-08-01&rft.volume=94&rft.issue=8&rft.spage=1571&rft.epage=1586&rft.pages=1571-1586&rft.issn=0018-9219&rft.eissn=1558-2256&rft.coden=IEEPAD&rft_id=info:doi/10.1109/JPROC.2006.879796&rft_dat=%3Cproquest_RIE%3E2343842651%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=865844630&rft_id=info:pmid/&rft_ieee_id=1705143&rfr_iscdi=true |