Optimization of Bonding Force, Sinking Value, and Potting Gap Size in COF Inner Lead Bonding Process

The thermo-mechanical properties of the polyimide film used in chip-on-film (COF) packaging have a significant effect on the inner lead bonding (ILB) mechanism. Furthermore, specifying an appropriate bonding force is essential in establishing a suitable compromise between a good bonding strength in...

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Veröffentlicht in:	IEEE transactions on advanced packaging 2009-08, Vol.32 (3), p.593-601
Hauptverfasser:	LIU, De-Shin, YEH, Shu-Shen, KAO, Chun-Teh, SHEN, Hung-Che, SHEN, Geng-Shin, LIU, Hung-Hsin
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences BONDING Bonding forces Bonding processes Chip-on-film (COF) Constitutive relationships Copper Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology finite element analysis (FEA) inner lead bonding (ILB) Integrated circuits MACHINE TOOLS MATHEMATICAL ANALYSIS Mathematical models Mechanical factors MECHANICAL PROPERTIES Motion pictures Optimization PACKAGING Performance evaluation polyimide film Polyimide resins POLYIMIDES RESINS Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Stress-strain relationships Studies tape automated bonding (TAB) Testing Thermomechanical processes
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