The Thermal Resistance of Solder Joints in High Brightness Light Emitting Diode (HB LED) Packages

We present a framework to calculate the thermal resistance of Au-Sn eutectic solder joint (R th, Au-Sn joint ) in high brightness light emitting diode (HB LED) packages whose heat extraction capability controls the optical efficiency and reliability of HB LEDs. Using the transient thermal measuremen...

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Veröffentlicht in:	IEEE transactions on components and packaging technologies 2009-12, Vol.32 (4), p.825-831
Hauptverfasser:	Yoon, Young-Bok, Park, Jin-Woo
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloying elements Brightness Finite element method Gold Heat transfer LED package Light emitting diodes Lighting control Mathematical analysis Optical control Packages Packaging Resistance heating Soldering Solders structure function Temperature control Thermal conductivity Thermal resistance
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