Effect of Lead-Free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates

The transition to lead-free soldering of printed circuit boards (PCBs) using solder alloys such as SnAgCu has resulted in higher temperature exposures during assembly compared with eutectic SnPb solders. The knowledge of PCB laminate material properties and their dependence on the material constitue...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	IEEE transactions on electronics packaging manufacturing 2009-10, Vol.32 (4), p.272-280
Hauptverfasser:	Sanapala, R., Sood, B., Das, D., Pecht, M.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Assembly Circuit boards Combinatorial analysis Design. Technologies. Operation analysis. Testing Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Environmentally friendly manufacturing techniques Exact sciences and technology Exposure FR-4 Glass glass transition temperature Guidelines halogen-free Integrated circuits Laminates Lead lead-free soldering Material properties Materials Materials selection printed circuit board (PCB) Printed circuit boards Printed circuits Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Soldering Solders Temperature Temperature dependence
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!