Study of Flip Chip Solder Joint Cracks Under Temperature Cycling Using a Laser Ultrasound Inspection System

The current techniques for nondestructive quality evaluation of bumped solder joint connections in electronics packages are either incapable of detecting solder joint cracks, or unsuitable for inline inspection due to cost and throughput reasons. As an alternative, a novel solder joint inspection sy...

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Veröffentlicht in:	IEEE transactions on components and packaging technologies 2009-03, Vol.32 (1), p.120-126
Hauptverfasser:	Lizheng Zhang, Ume, I.C., Gamalski, J., Galuschki, K.-P.
Format:	Artikel
Sprache:	eng
Schlagworte:	Costs Electronics packaging Fiber lasers Flip chip solder joints Inspection Laser ultrasound inspection Printed circuit boards solder joint cracks Soldering Surface cracks Surface emitting lasers Temperature temperature cycling Ultrasonic imaging
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