Novel Methods for Modeling of Multiple Vias in Multilayered Parallel-Plate Structures
This paper presents novel modeling methods for accurate and efficient analysis of coupling of multiple vias in finite-sized multilayered parallel-plate structures. The new modeling methods address two open problems related to the modal expansion with the T-matrix method for the analysis of via coupl...
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| Veröffentlicht in: | IEEE transactions on microwave theory and techniques 2009-07, Vol.57 (7), p.1724-1733 |
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| creator | En-Xiao Liu Er-Ping Li Zaw Zaw Oo Xingchang Wei Yaojiang Zhang Vahldieck, R. |
| description | This paper presents novel modeling methods for accurate and efficient analysis of coupling of multiple vias in finite-sized multilayered parallel-plate structures. The new modeling methods address two open problems related to the modal expansion with the T-matrix method for the analysis of via coupling. First, a novel boundary modeling method, called the frequency-dependent cylinder layer (FDCL), is proposed to resolve the open problem of boundary modeling. In the FDCL, virtual cylinders with dynamic radii are postulated to approximate the original finite-sized boundary of parallel-plate structures. Second, a generalized T-matrix model, which is derived by the mode-matching technique, is created to characterize the coupling effect for vias penetrating more than one layer in a multilayered structure. With the two open problems successfully solved, the modal expansion with the T-matrix method incorporating the FDCL boundary modeling method and the generalized T-matrix model can now be fully utilized for efficient and accurate analysis of finite-sized multilayered parallel-plate structures with a large number of vias. Both numerical and experimental verifications are presented to validate the new modeling methods. |
| doi_str_mv | 10.1109/TMTT.2009.2022883 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_proquest_journals_856914548</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>5075605</ieee_id><sourcerecordid>2291927201</sourcerecordid><originalsourceid>FETCH-LOGICAL-c385t-2b39739fc58ff951db91507d21bd975fec8abf2bbcfebd2869b6a9b108a2afc33</originalsourceid><addsrcrecordid>eNp9kU1rGzEQhkVIoU7aH1ByEYUkp3X1sdqVjsHkoxC3gTq9Ckk7SjbIK1faLfjfR8bGhx56mWFmnnlh5kXoCyVzSon6tlquVnNGiCqBMSn5CZpRIdpKNS05RTNCqKxULclHdJbzWylrQeQMPf-IfyHgJYyvscvYx4SXsYPQDy84erycwthvAuDfvcm4H_aNYLaQoMNPJpkQIFRPwYyAf41pcuOUIH9CH7wJGT4f8jl6vrtdLR6qx5_33xc3j5XjUowVs1y1XHknpPdK0M4qKkjbMWo71QoPThrrmbXOg-2YbJRtjLKUSMOMd5yfo-u97ibFPxPkUa_77CAEM0CcspZS8VYx0Rby6r8kbzhXStYF_PoP-BanNJQrtBSNKm-rZYHoHnIp5pzA603q1yZtNSV654fe-aF3fuiDH2Xn8iBssjPBJzO4Ph8XGW1rRgQp3MWe6wHgOC5vEQ0R_B27jZQJ</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>856914548</pqid></control><display><type>article</type><title>Novel Methods for Modeling of Multiple Vias in Multilayered Parallel-Plate Structures</title><source>IEEE/IET Electronic Library</source><creator>En-Xiao Liu ; Er-Ping Li ; Zaw Zaw Oo ; Xingchang Wei ; Yaojiang Zhang ; Vahldieck, R.</creator><creatorcontrib>En-Xiao Liu ; Er-Ping Li ; Zaw Zaw Oo ; Xingchang Wei ; Yaojiang Zhang ; Vahldieck, R.</creatorcontrib><description>This paper presents novel modeling methods for accurate and efficient analysis of coupling of multiple vias in finite-sized multilayered parallel-plate structures. The new modeling methods address two open problems related to the modal expansion with the T-matrix method for the analysis of via coupling. First, a novel boundary modeling method, called the frequency-dependent cylinder layer (FDCL), is proposed to resolve the open problem of boundary modeling. In the FDCL, virtual cylinders with dynamic radii are postulated to approximate the original finite-sized boundary of parallel-plate structures. Second, a generalized T-matrix model, which is derived by the mode-matching technique, is created to characterize the coupling effect for vias penetrating more than one layer in a multilayered structure. With the two open problems successfully solved, the modal expansion with the T-matrix method incorporating the FDCL boundary modeling method and the generalized T-matrix model can now be fully utilized for efficient and accurate analysis of finite-sized multilayered parallel-plate structures with a large number of vias. Both numerical and experimental verifications are presented to validate the new modeling methods.</description><identifier>ISSN: 0018-9480</identifier><identifier>EISSN: 1557-9670</identifier><identifier>DOI: 10.1109/TMTT.2009.2022883</identifier><identifier>CODEN: IETMAB</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>Applied sciences ; Approximation ; Boundaries ; Boundary modeling ; Circuit noise ; Coupling circuits ; Cylinders ; Design. Technologies. Operation analysis. Testing ; Dynamics ; Electromagnetic propagation ; Electromagnetic scattering ; Electromagnetic waveguides ; Electronics ; Electronics packaging ; Exact sciences and technology ; Frequency ; generalized T-matrix ; high-speed electronic package modeling ; Integrated circuits ; Joining ; Magnetic analysis ; Mathematical models ; Methods ; Microwaves ; modal expansion ; Power transmission ; Printed circuits ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; signal and power integrity ; via coupling</subject><ispartof>IEEE transactions on microwave theory and techniques, 2009-07, Vol.57 (7), p.1724-1733</ispartof><rights>2009 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2009</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c385t-2b39739fc58ff951db91507d21bd975fec8abf2bbcfebd2869b6a9b108a2afc33</citedby><cites>FETCH-LOGICAL-c385t-2b39739fc58ff951db91507d21bd975fec8abf2bbcfebd2869b6a9b108a2afc33</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5075605$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27901,27902,54733</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5075605$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=21742050$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>En-Xiao Liu</creatorcontrib><creatorcontrib>Er-Ping Li</creatorcontrib><creatorcontrib>Zaw Zaw Oo</creatorcontrib><creatorcontrib>Xingchang Wei</creatorcontrib><creatorcontrib>Yaojiang Zhang</creatorcontrib><creatorcontrib>Vahldieck, R.</creatorcontrib><title>Novel Methods for Modeling of Multiple Vias in Multilayered Parallel-Plate Structures</title><title>IEEE transactions on microwave theory and techniques</title><addtitle>TMTT</addtitle><description>This paper presents novel modeling methods for accurate and efficient analysis of coupling of multiple vias in finite-sized multilayered parallel-plate structures. The new modeling methods address two open problems related to the modal expansion with the T-matrix method for the analysis of via coupling. First, a novel boundary modeling method, called the frequency-dependent cylinder layer (FDCL), is proposed to resolve the open problem of boundary modeling. In the FDCL, virtual cylinders with dynamic radii are postulated to approximate the original finite-sized boundary of parallel-plate structures. Second, a generalized T-matrix model, which is derived by the mode-matching technique, is created to characterize the coupling effect for vias penetrating more than one layer in a multilayered structure. With the two open problems successfully solved, the modal expansion with the T-matrix method incorporating the FDCL boundary modeling method and the generalized T-matrix model can now be fully utilized for efficient and accurate analysis of finite-sized multilayered parallel-plate structures with a large number of vias. Both numerical and experimental verifications are presented to validate the new modeling methods.</description><subject>Applied sciences</subject><subject>Approximation</subject><subject>Boundaries</subject><subject>Boundary modeling</subject><subject>Circuit noise</subject><subject>Coupling circuits</subject><subject>Cylinders</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Dynamics</subject><subject>Electromagnetic propagation</subject><subject>Electromagnetic scattering</subject><subject>Electromagnetic waveguides</subject><subject>Electronics</subject><subject>Electronics packaging</subject><subject>Exact sciences and technology</subject><subject>Frequency</subject><subject>generalized T-matrix</subject><subject>high-speed electronic package modeling</subject><subject>Integrated circuits</subject><subject>Joining</subject><subject>Magnetic analysis</subject><subject>Mathematical models</subject><subject>Methods</subject><subject>Microwaves</subject><subject>modal expansion</subject><subject>Power transmission</subject><subject>Printed circuits</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>signal and power integrity</subject><subject>via coupling</subject><issn>0018-9480</issn><issn>1557-9670</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2009</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNp9kU1rGzEQhkVIoU7aH1ByEYUkp3X1sdqVjsHkoxC3gTq9Ckk7SjbIK1faLfjfR8bGhx56mWFmnnlh5kXoCyVzSon6tlquVnNGiCqBMSn5CZpRIdpKNS05RTNCqKxULclHdJbzWylrQeQMPf-IfyHgJYyvscvYx4SXsYPQDy84erycwthvAuDfvcm4H_aNYLaQoMNPJpkQIFRPwYyAf41pcuOUIH9CH7wJGT4f8jl6vrtdLR6qx5_33xc3j5XjUowVs1y1XHknpPdK0M4qKkjbMWo71QoPThrrmbXOg-2YbJRtjLKUSMOMd5yfo-u97ibFPxPkUa_77CAEM0CcspZS8VYx0Rby6r8kbzhXStYF_PoP-BanNJQrtBSNKm-rZYHoHnIp5pzA603q1yZtNSV654fe-aF3fuiDH2Xn8iBssjPBJzO4Ph8XGW1rRgQp3MWe6wHgOC5vEQ0R_B27jZQJ</recordid><startdate>20090701</startdate><enddate>20090701</enddate><creator>En-Xiao Liu</creator><creator>Er-Ping Li</creator><creator>Zaw Zaw Oo</creator><creator>Xingchang Wei</creator><creator>Yaojiang Zhang</creator><creator>Vahldieck, R.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>F28</scope><scope>FR3</scope></search><sort><creationdate>20090701</creationdate><title>Novel Methods for Modeling of Multiple Vias in Multilayered Parallel-Plate Structures</title><author>En-Xiao Liu ; Er-Ping Li ; Zaw Zaw Oo ; Xingchang Wei ; Yaojiang Zhang ; Vahldieck, R.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c385t-2b39739fc58ff951db91507d21bd975fec8abf2bbcfebd2869b6a9b108a2afc33</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2009</creationdate><topic>Applied sciences</topic><topic>Approximation</topic><topic>Boundaries</topic><topic>Boundary modeling</topic><topic>Circuit noise</topic><topic>Coupling circuits</topic><topic>Cylinders</topic><topic>Design. Technologies. Operation analysis. Testing</topic><topic>Dynamics</topic><topic>Electromagnetic propagation</topic><topic>Electromagnetic scattering</topic><topic>Electromagnetic waveguides</topic><topic>Electronics</topic><topic>Electronics packaging</topic><topic>Exact sciences and technology</topic><topic>Frequency</topic><topic>generalized T-matrix</topic><topic>high-speed electronic package modeling</topic><topic>Integrated circuits</topic><topic>Joining</topic><topic>Magnetic analysis</topic><topic>Mathematical models</topic><topic>Methods</topic><topic>Microwaves</topic><topic>modal expansion</topic><topic>Power transmission</topic><topic>Printed circuits</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>signal and power integrity</topic><topic>via coupling</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>En-Xiao Liu</creatorcontrib><creatorcontrib>Er-Ping Li</creatorcontrib><creatorcontrib>Zaw Zaw Oo</creatorcontrib><creatorcontrib>Xingchang Wei</creatorcontrib><creatorcontrib>Yaojiang Zhang</creatorcontrib><creatorcontrib>Vahldieck, R.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005–Present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE/IET Electronic Library</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><jtitle>IEEE transactions on microwave theory and techniques</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>En-Xiao Liu</au><au>Er-Ping Li</au><au>Zaw Zaw Oo</au><au>Xingchang Wei</au><au>Yaojiang Zhang</au><au>Vahldieck, R.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Novel Methods for Modeling of Multiple Vias in Multilayered Parallel-Plate Structures</atitle><jtitle>IEEE transactions on microwave theory and techniques</jtitle><stitle>TMTT</stitle><date>2009-07-01</date><risdate>2009</risdate><volume>57</volume><issue>7</issue><spage>1724</spage><epage>1733</epage><pages>1724-1733</pages><issn>0018-9480</issn><eissn>1557-9670</eissn><coden>IETMAB</coden><abstract>This paper presents novel modeling methods for accurate and efficient analysis of coupling of multiple vias in finite-sized multilayered parallel-plate structures. The new modeling methods address two open problems related to the modal expansion with the T-matrix method for the analysis of via coupling. First, a novel boundary modeling method, called the frequency-dependent cylinder layer (FDCL), is proposed to resolve the open problem of boundary modeling. In the FDCL, virtual cylinders with dynamic radii are postulated to approximate the original finite-sized boundary of parallel-plate structures. Second, a generalized T-matrix model, which is derived by the mode-matching technique, is created to characterize the coupling effect for vias penetrating more than one layer in a multilayered structure. With the two open problems successfully solved, the modal expansion with the T-matrix method incorporating the FDCL boundary modeling method and the generalized T-matrix model can now be fully utilized for efficient and accurate analysis of finite-sized multilayered parallel-plate structures with a large number of vias. Both numerical and experimental verifications are presented to validate the new modeling methods.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/TMTT.2009.2022883</doi><tpages>10</tpages></addata></record> |
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| subjects | Applied sciences Approximation Boundaries Boundary modeling Circuit noise Coupling circuits Cylinders Design. Technologies. Operation analysis. Testing Dynamics Electromagnetic propagation Electromagnetic scattering Electromagnetic waveguides Electronics Electronics packaging Exact sciences and technology Frequency generalized T-matrix high-speed electronic package modeling Integrated circuits Joining Magnetic analysis Mathematical models Methods Microwaves modal expansion Power transmission Printed circuits Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices signal and power integrity via coupling |
| title | Novel Methods for Modeling of Multiple Vias in Multilayered Parallel-Plate Structures |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-07T15%3A12%3A58IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Novel%20Methods%20for%20Modeling%20of%20Multiple%20Vias%20in%20Multilayered%20Parallel-Plate%20Structures&rft.jtitle=IEEE%20transactions%20on%20microwave%20theory%20and%20techniques&rft.au=En-Xiao%20Liu&rft.date=2009-07-01&rft.volume=57&rft.issue=7&rft.spage=1724&rft.epage=1733&rft.pages=1724-1733&rft.issn=0018-9480&rft.eissn=1557-9670&rft.coden=IETMAB&rft_id=info:doi/10.1109/TMTT.2009.2022883&rft_dat=%3Cproquest_RIE%3E2291927201%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=856914548&rft_id=info:pmid/&rft_ieee_id=5075605&rfr_iscdi=true |