Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz

Analytical models for vias and traces are presented for simulation of multilayer interconnects at the package and printed circuit board levels. Vias are modeled using an analytical formulation for the parallel-plate impedance and capacitive elements, whereas the trace-via transitions are described b...

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Veröffentlicht in:	IEEE transactions on microwave theory and techniques 2009-08, Vol.57 (8), p.2072-2083
Hauptverfasser:	Rimolo-Donadio, R., Xiaoxiong Gu, Kwark, Y.H., Ritter, M.B., Archambeault, B., de Paulis, F., Yaojiang Zhang, Jun Fan, Bruns, H.-D., Schuster, C.
Format:	Artikel
Sprache:	eng
Schlagworte:	Analytical models Applied sciences Circuit simulation Computer simulation Decomposition Design. Technologies. Operation analysis. Testing Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Impedance Integrated circuit interconnections Integrated circuits Mathematical analysis Mathematical models Microwaves Modal decomposition Multilayers Nonhomogeneous media package Packages Packaging power distribution network (PDN) Power system interconnection Power system modeling Power systems printed circuit board (PCB) Printed circuits Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices via models
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