High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP)
With the increasing demand for system integration to cater to continuously increasing number of I/Os as well as higher operating frequencies, reconfigured wafer-level packaging, or embedded WLP (EMWLP) is emerging as a promising technology for integration. This platform allows integrated passives to...
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| Veröffentlicht in: | IEEE transactions on advanced packaging 2010-11, Vol.33 (4), p.1061-1071 |
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| container_title | IEEE transactions on advanced packaging |
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| creator | Ying Ying Lim Xianghua Xiao Vempati, Srinivasa Rao Su, Nandar Kumar, Aditya Sharma, Gaurav Teck Guan Lim Vaidyanathan, Kripesh Jinglin Shi Lau, John H Shiguo Liu |
| description | With the increasing demand for system integration to cater to continuously increasing number of I/Os as well as higher operating frequencies, reconfigured wafer-level packaging, or embedded WLP (EMWLP) is emerging as a promising technology for integration. This platform allows integrated passives to be designed in the redistribution layers using the mold compound as a substrate, which significantly improves the passives performance compared to those of on-chip. In this paper, we present low loss passives on EMWLP platform demonstrated in a 5.5-GHz band pass filter targeted for wireless local area network (WLAN) applications. To ascertain the feasibility of designing for low loss millimeter wave passives on EMWLP, transmission lines were designed and their loss characteristics investigated up to 110 GHz, which are reported here. Subsequently we demonstrate for the first time a narrowband low loss 77-GHz band pass filter on EMWLP platform, with a good correlation obtained between simulation and measurement results. In addition, a temperature dependence characterization was performed on the 77-GHz filter, with little variation in the measured filter characteristics observed. |
| doi_str_mv | 10.1109/TADVP.2010.2058849 |
| format | Article |
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This platform allows integrated passives to be designed in the redistribution layers using the mold compound as a substrate, which significantly improves the passives performance compared to those of on-chip. In this paper, we present low loss passives on EMWLP platform demonstrated in a 5.5-GHz band pass filter targeted for wireless local area network (WLAN) applications. To ascertain the feasibility of designing for low loss millimeter wave passives on EMWLP, transmission lines were designed and their loss characteristics investigated up to 110 GHz, which are reported here. Subsequently we demonstrate for the first time a narrowband low loss 77-GHz band pass filter on EMWLP platform, with a good correlation obtained between simulation and measurement results. In addition, a temperature dependence characterization was performed on the 77-GHz filter, with little variation in the measured filter characteristics observed.</description><identifier>ISSN: 1521-3323</identifier><identifier>EISSN: 1557-9980</identifier><identifier>DOI: 10.1109/TADVP.2010.2058849</identifier><identifier>CODEN: ITAPFZ</identifier><language>eng</language><publisher>Piscataway, NJ: IEEE</publisher><subject>Applied sciences ; Band pass filters ; Circuit properties ; Electric, optical and optoelectronic circuits ; Electronic circuits ; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics ; Electronics ; Embedded ; Exact sciences and technology ; filter ; Frequency ; Frequency filters ; Local area networks ; Loss measurement ; low loss ; Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits ; millimeter wave ; Millimeter wave measurements ; Millimeter wave technology ; mold ; Narrowband ; Propagation losses ; Semiconductors ; temperature variation ; Transmission line measurements ; Wafer scale integration ; wafer-level packaging (WLP) ; Wireless LAN</subject><ispartof>IEEE transactions on advanced packaging, 2010-11, Vol.33 (4), p.1061-1071</ispartof><rights>2015 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Nov 2010</rights><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c324t-9be1063a0f2fdd2771e03bbb63f8d5646aad829ebfb60fb58d79ca373625d8ff3</citedby><cites>FETCH-LOGICAL-c324t-9be1063a0f2fdd2771e03bbb63f8d5646aad829ebfb60fb58d79ca373625d8ff3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5549953$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>315,781,785,797,27929,27930,54763</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5549953$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=23810909$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Ying Ying Lim</creatorcontrib><creatorcontrib>Xianghua Xiao</creatorcontrib><creatorcontrib>Vempati, Srinivasa Rao</creatorcontrib><creatorcontrib>Su, Nandar</creatorcontrib><creatorcontrib>Kumar, Aditya</creatorcontrib><creatorcontrib>Sharma, Gaurav</creatorcontrib><creatorcontrib>Teck Guan Lim</creatorcontrib><creatorcontrib>Vaidyanathan, Kripesh</creatorcontrib><creatorcontrib>Jinglin Shi</creatorcontrib><creatorcontrib>Lau, John H</creatorcontrib><creatorcontrib>Shiguo Liu</creatorcontrib><title>High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP)</title><title>IEEE transactions on advanced packaging</title><addtitle>TADVP</addtitle><description>With the increasing demand for system integration to cater to continuously increasing number of I/Os as well as higher operating frequencies, reconfigured wafer-level packaging, or embedded WLP (EMWLP) is emerging as a promising technology for integration. This platform allows integrated passives to be designed in the redistribution layers using the mold compound as a substrate, which significantly improves the passives performance compared to those of on-chip. In this paper, we present low loss passives on EMWLP platform demonstrated in a 5.5-GHz band pass filter targeted for wireless local area network (WLAN) applications. To ascertain the feasibility of designing for low loss millimeter wave passives on EMWLP, transmission lines were designed and their loss characteristics investigated up to 110 GHz, which are reported here. Subsequently we demonstrate for the first time a narrowband low loss 77-GHz band pass filter on EMWLP platform, with a good correlation obtained between simulation and measurement results. In addition, a temperature dependence characterization was performed on the 77-GHz filter, with little variation in the measured filter characteristics observed.</description><subject>Applied sciences</subject><subject>Band pass filters</subject><subject>Circuit properties</subject><subject>Electric, optical and optoelectronic circuits</subject><subject>Electronic circuits</subject><subject>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</subject><subject>Electronics</subject><subject>Embedded</subject><subject>Exact sciences and technology</subject><subject>filter</subject><subject>Frequency</subject><subject>Frequency filters</subject><subject>Local area networks</subject><subject>Loss measurement</subject><subject>low loss</subject><subject>Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits</subject><subject>millimeter wave</subject><subject>Millimeter wave measurements</subject><subject>Millimeter wave technology</subject><subject>mold</subject><subject>Narrowband</subject><subject>Propagation losses</subject><subject>Semiconductors</subject><subject>temperature variation</subject><subject>Transmission line measurements</subject><subject>Wafer scale integration</subject><subject>wafer-level packaging (WLP)</subject><subject>Wireless LAN</subject><issn>1521-3323</issn><issn>1557-9980</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2010</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNo9kMtu1DAUhiMEEqXwAmVjISHBIsWXOLGXVTt0KqUiiGlnGZ3Ex1OXXFo7M6g8Bw-M0xl1YdnW-f7_SF-SnDB6yhjV31ZnF7fVKafxz6lUKtOvkiMmZZFqrejr-c1ZKgQXb5N3IdxTyjKV8aPk39Jt7sjPLXRueiIwGFKOf-IJgVy7rnM9TujJGnZIKgjB7TCQC-zHIUweJjRkGklRpJfLv8SOnvxyFVlhezeM3bhxkb0JbtiQRd-gMZFeg0WflrjDLva1v2Ezj6sOppjuyZfF9bqsvr5P3ljoAn443MfJzffF6nyZlj8ur87PyrQVPJtS3SCjuQBquTWGFwVDKpqmyYVVRuZZDmAU19jYJqe2kcoUugVRiJxLo6wVx8mnfe-DHx-3GKb6ftz6Ia6slSgyLRVTEeJ7qPXRikdbP3jXg3-qGa1n-fWz_HqWXx_kx9DnQzOEFjrrYWhdeElyoWKQztzHPecQ8WUsZaa1FOI_WyaOBg</recordid><startdate>20101101</startdate><enddate>20101101</enddate><creator>Ying Ying Lim</creator><creator>Xianghua Xiao</creator><creator>Vempati, Srinivasa Rao</creator><creator>Su, Nandar</creator><creator>Kumar, Aditya</creator><creator>Sharma, Gaurav</creator><creator>Teck Guan Lim</creator><creator>Vaidyanathan, Kripesh</creator><creator>Jinglin Shi</creator><creator>Lau, John H</creator><creator>Shiguo Liu</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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Passive components, printed wiring boards, connectics</topic><topic>Electronics</topic><topic>Embedded</topic><topic>Exact sciences and technology</topic><topic>filter</topic><topic>Frequency</topic><topic>Frequency filters</topic><topic>Local area networks</topic><topic>Loss measurement</topic><topic>low loss</topic><topic>Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits</topic><topic>millimeter wave</topic><topic>Millimeter wave measurements</topic><topic>Millimeter wave technology</topic><topic>mold</topic><topic>Narrowband</topic><topic>Propagation losses</topic><topic>Semiconductors</topic><topic>temperature variation</topic><topic>Transmission line measurements</topic><topic>Wafer scale integration</topic><topic>wafer-level packaging (WLP)</topic><topic>Wireless LAN</topic><toplevel>online_resources</toplevel><creatorcontrib>Ying Ying Lim</creatorcontrib><creatorcontrib>Xianghua Xiao</creatorcontrib><creatorcontrib>Vempati, Srinivasa Rao</creatorcontrib><creatorcontrib>Su, Nandar</creatorcontrib><creatorcontrib>Kumar, Aditya</creatorcontrib><creatorcontrib>Sharma, Gaurav</creatorcontrib><creatorcontrib>Teck Guan Lim</creatorcontrib><creatorcontrib>Vaidyanathan, Kripesh</creatorcontrib><creatorcontrib>Jinglin Shi</creatorcontrib><creatorcontrib>Lau, John H</creatorcontrib><creatorcontrib>Shiguo Liu</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><jtitle>IEEE transactions on advanced packaging</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ying Ying Lim</au><au>Xianghua Xiao</au><au>Vempati, Srinivasa Rao</au><au>Su, Nandar</au><au>Kumar, Aditya</au><au>Sharma, Gaurav</au><au>Teck Guan Lim</au><au>Vaidyanathan, Kripesh</au><au>Jinglin Shi</au><au>Lau, John H</au><au>Shiguo Liu</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP)</atitle><jtitle>IEEE transactions on advanced packaging</jtitle><stitle>TADVP</stitle><date>2010-11-01</date><risdate>2010</risdate><volume>33</volume><issue>4</issue><spage>1061</spage><epage>1071</epage><pages>1061-1071</pages><issn>1521-3323</issn><eissn>1557-9980</eissn><coden>ITAPFZ</coden><abstract>With the increasing demand for system integration to cater to continuously increasing number of I/Os as well as higher operating frequencies, reconfigured wafer-level packaging, or embedded WLP (EMWLP) is emerging as a promising technology for integration. 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| ispartof | IEEE transactions on advanced packaging, 2010-11, Vol.33 (4), p.1061-1071 |
| issn | 1521-3323 1557-9980 |
| language | eng |
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| source | IEEE Electronic Library (IEL) |
| subjects | Applied sciences Band pass filters Circuit properties Electric, optical and optoelectronic circuits Electronic circuits Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Embedded Exact sciences and technology filter Frequency Frequency filters Local area networks Loss measurement low loss Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits millimeter wave Millimeter wave measurements Millimeter wave technology mold Narrowband Propagation losses Semiconductors temperature variation Transmission line measurements Wafer scale integration wafer-level packaging (WLP) Wireless LAN |
| title | High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP) |
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