Impact Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Under Bump Metallization After Aging at 150°C
Nonmagnetic Ni(V) metal and low consumption rate with solders are the advantages of sputtered Ti/Ni(V)/Cu under bump metallization (UBM). However, a Sn-rich phase (“Sn-patch” herein) can form in the Ni(V) layer after reflow and aging. In lead-free solder, Sn-patches form and grow more quickly than i...
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| Veröffentlicht in: | Journal of electronic materials 2010-12, Vol.39 (12), p.2558-2563 |
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| creator | Wang, Kai-Jheng Duh, Jenq-Gong Sykes, Bob Schade, Dirk |
| description | Nonmagnetic Ni(V) metal and low consumption rate with solders are the advantages of sputtered Ti/Ni(V)/Cu under bump metallization (UBM). However, a Sn-rich phase (“Sn-patch” herein) can form in the Ni(V) layer after reflow and aging. In lead-free solder, Sn-patches form and grow more quickly than in Sn-Pb solder. Thus, the effect of Sn-patches on solder joint reliability becomes critical. In this study, Sn-3.0Ag-0.5Cu solder was reflowed with Ti/Ni(V)/Cu UBM at 250°C for 60 s, and then aged at 150°C for various durations. A high-speed impact test was introduced to evaluate solder joint reliability. After impact testing, it was found that, the larger the Sn-patch, the greater the propensity of the solder joint to suffer brittle fracture. The correlation between Sn-patch and solder joint reliability is discussed. |
| doi_str_mv | 10.1007/s11664-010-1370-6 |
| format | Article |
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However, a Sn-rich phase (“Sn-patch” herein) can form in the Ni(V) layer after reflow and aging. In lead-free solder, Sn-patches form and grow more quickly than in Sn-Pb solder. Thus, the effect of Sn-patches on solder joint reliability becomes critical. In this study, Sn-3.0Ag-0.5Cu solder was reflowed with Ti/Ni(V)/Cu UBM at 250°C for 60 s, and then aged at 150°C for various durations. A high-speed impact test was introduced to evaluate solder joint reliability. After impact testing, it was found that, the larger the Sn-patch, the greater the propensity of the solder joint to suffer brittle fracture. The correlation between Sn-patch and solder joint reliability is discussed.</description><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>DOI: 10.1007/s11664-010-1370-6</identifier><identifier>CODEN: JECMA5</identifier><language>eng</language><publisher>Boston: Springer US</publisher><subject>Applied sciences ; Brazing. Soldering ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Electromagnetism ; Electronics ; Electronics and Microelectronics ; Exact sciences and technology ; Instrumentation ; Joining, thermal cutting: metallurgical aspects ; Materials ; Materials Science ; Metals. Metallurgy ; Microstructure ; Optical and Electronic Materials ; Soldering ; Solid State Physics</subject><ispartof>Journal of electronic materials, 2010-12, Vol.39 (12), p.2558-2563</ispartof><rights>TMS 2010</rights><rights>2015 INIST-CNRS</rights><rights>Copyright Minerals, Metals & Materials Society Dec 2010</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c2606-ba3725e0f614e55a20c50bbc05f7c759b0b0376d16c562630c44619a251c4fc03</citedby><cites>FETCH-LOGICAL-c2606-ba3725e0f614e55a20c50bbc05f7c759b0b0376d16c562630c44619a251c4fc03</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s11664-010-1370-6$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s11664-010-1370-6$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>309,310,314,780,784,789,790,23930,23931,25140,27924,27925,41488,42557,51319</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=23636066$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Wang, Kai-Jheng</creatorcontrib><creatorcontrib>Duh, Jenq-Gong</creatorcontrib><creatorcontrib>Sykes, Bob</creatorcontrib><creatorcontrib>Schade, Dirk</creatorcontrib><title>Impact Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Under Bump Metallization After Aging at 150°C</title><title>Journal of electronic materials</title><addtitle>Journal of Elec Materi</addtitle><description>Nonmagnetic Ni(V) metal and low consumption rate with solders are the advantages of sputtered Ti/Ni(V)/Cu under bump metallization (UBM). However, a Sn-rich phase (“Sn-patch” herein) can form in the Ni(V) layer after reflow and aging. In lead-free solder, Sn-patches form and grow more quickly than in Sn-Pb solder. Thus, the effect of Sn-patches on solder joint reliability becomes critical. In this study, Sn-3.0Ag-0.5Cu solder was reflowed with Ti/Ni(V)/Cu UBM at 250°C for 60 s, and then aged at 150°C for various durations. A high-speed impact test was introduced to evaluate solder joint reliability. After impact testing, it was found that, the larger the Sn-patch, the greater the propensity of the solder joint to suffer brittle fracture. The correlation between Sn-patch and solder joint reliability is discussed.</description><subject>Applied sciences</subject><subject>Brazing. Soldering</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Electromagnetism</subject><subject>Electronics</subject><subject>Electronics and Microelectronics</subject><subject>Exact sciences and technology</subject><subject>Instrumentation</subject><subject>Joining, thermal cutting: metallurgical aspects</subject><subject>Materials</subject><subject>Materials Science</subject><subject>Metals. Metallurgy</subject><subject>Microstructure</subject><subject>Optical and Electronic Materials</subject><subject>Soldering</subject><subject>Solid State Physics</subject><issn>0361-5235</issn><issn>1543-186X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2010</creationdate><recordtype>article</recordtype><sourceid>8G5</sourceid><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><sourceid>GUQSH</sourceid><sourceid>M2O</sourceid><recordid>eNp1UE1Pg0AQ3RhNrNUf4G1jYqKHbWdYdsEjEj-aVD20Nd7IsgWkoYC7EKO_yt_gLxNCoydPk3nz3puZR8gpwgQBvKlFlNJlgMCQe8DkHhmhcDlDX77skxFwiUw4XBySI2s3ACjQxxHJZtta6YYuE9vkZUarlC5KxicQZAwmImzpoirWiaHvefNKl_n0Mb94vpx2-Krs4et2W9OHpFFFkX-qJq9KGqRNNwiy3k41FAV8f4XH5CBVhU1OdnVMVrc3y_CezZ_uZmEwZ9qRIFmsuOeIBFKJbiKEckALiGMNIvW0J65iiIF7co1SC-lIDtp1JV4pR6B2Uw18TM4G39pUb233VLSpWlN2KyMfOXJfgOxIOJC0qaw1SRrVJt8q8xEhRH2c0RBnBH3fxRn1mvOdsbJaFalRpc7tr9DhkncP9Dxn4NluVGaJ-Tvgf_Mf8RCAhw</recordid><startdate>201012</startdate><enddate>201012</enddate><creator>Wang, Kai-Jheng</creator><creator>Duh, Jenq-Gong</creator><creator>Sykes, Bob</creator><creator>Schade, Dirk</creator><general>Springer US</general><general>Springer</general><general>Springer Nature B.V</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7XB</scope><scope>88I</scope><scope>8AF</scope><scope>8AO</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8G5</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>GUQSH</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M2O</scope><scope>M2P</scope><scope>M7S</scope><scope>MBDVC</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope><scope>Q9U</scope><scope>S0X</scope></search><sort><creationdate>201012</creationdate><title>Impact Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Under Bump Metallization After Aging at 150°C</title><author>Wang, Kai-Jheng ; Duh, Jenq-Gong ; Sykes, Bob ; Schade, Dirk</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c2606-ba3725e0f614e55a20c50bbc05f7c759b0b0376d16c562630c44619a251c4fc03</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2010</creationdate><topic>Applied sciences</topic><topic>Brazing. Soldering</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry and Materials Science</topic><topic>Electromagnetism</topic><topic>Electronics</topic><topic>Electronics and Microelectronics</topic><topic>Exact sciences and technology</topic><topic>Instrumentation</topic><topic>Joining, thermal cutting: metallurgical aspects</topic><topic>Materials</topic><topic>Materials Science</topic><topic>Metals. Metallurgy</topic><topic>Microstructure</topic><topic>Optical and Electronic Materials</topic><topic>Soldering</topic><topic>Solid State Physics</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Wang, Kai-Jheng</creatorcontrib><creatorcontrib>Duh, Jenq-Gong</creatorcontrib><creatorcontrib>Sykes, Bob</creatorcontrib><creatorcontrib>Schade, Dirk</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>ProQuest Pharma Collection</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Research Library (Alumni Edition)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Research Library</collection><collection>Science Database</collection><collection>Engineering Database</collection><collection>Research Library (Corporate)</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering Collection</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><jtitle>Journal of electronic materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Wang, Kai-Jheng</au><au>Duh, Jenq-Gong</au><au>Sykes, Bob</au><au>Schade, Dirk</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Impact Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Under Bump Metallization After Aging at 150°C</atitle><jtitle>Journal of electronic materials</jtitle><stitle>Journal of Elec Materi</stitle><date>2010-12</date><risdate>2010</risdate><volume>39</volume><issue>12</issue><spage>2558</spage><epage>2563</epage><pages>2558-2563</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><coden>JECMA5</coden><abstract>Nonmagnetic Ni(V) metal and low consumption rate with solders are the advantages of sputtered Ti/Ni(V)/Cu under bump metallization (UBM). However, a Sn-rich phase (“Sn-patch” herein) can form in the Ni(V) layer after reflow and aging. In lead-free solder, Sn-patches form and grow more quickly than in Sn-Pb solder. Thus, the effect of Sn-patches on solder joint reliability becomes critical. In this study, Sn-3.0Ag-0.5Cu solder was reflowed with Ti/Ni(V)/Cu UBM at 250°C for 60 s, and then aged at 150°C for various durations. A high-speed impact test was introduced to evaluate solder joint reliability. After impact testing, it was found that, the larger the Sn-patch, the greater the propensity of the solder joint to suffer brittle fracture. The correlation between Sn-patch and solder joint reliability is discussed.</abstract><cop>Boston</cop><pub>Springer US</pub><doi>10.1007/s11664-010-1370-6</doi><tpages>6</tpages></addata></record> |
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| subjects | Applied sciences Brazing. Soldering Characterization and Evaluation of Materials Chemistry and Materials Science Electromagnetism Electronics Electronics and Microelectronics Exact sciences and technology Instrumentation Joining, thermal cutting: metallurgical aspects Materials Materials Science Metals. Metallurgy Microstructure Optical and Electronic Materials Soldering Solid State Physics |
| title | Impact Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Under Bump Metallization After Aging at 150°C |
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