An active ester‐cured resveratrol‐based epoxy film with excellent thermal and dielectric performances for high‐frequency applications

In the field of electronic packaging, epoxy resins with good thermal and dielectric performances have attracted extensive attention. In this work, a novel epoxy resin was synthesized from resveratrol, and its structure was characterized by NMR and FTIR. The resveratrol‐based epoxy resin was cured wi...

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Veröffentlicht in:	Journal of applied polymer science 2025-02, Vol.142 (6), p.n/a
Hauptverfasser:	Wang, Xiang, Zhao, Zhixi, Tian, Jizhen, Zou, Huawei, Liu, Pengbo
Format:	Artikel
Sprache:	eng
Schlagworte:	biomaterials dielectric properties Dissipation factor Electronic packaging Epoxy resins Glass transition temperature NMR Nuclear magnetic resonance packaging Synthesis Thermal expansion thermosets
Online-Zugang:	Volltext
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